Patents by Inventor MICHAEL LEIPENAT

MICHAEL LEIPENAT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Package with Balanced Impedance
    Publication number: 20240079297
    Abstract: A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 7, 2024
    Inventors: Peter Luniewski, Markus Neubert, Michael Fuegl, Waldemar Jakobi, Michael Leipenat, Egbert Lamminger
  • POWER MODULE
    Publication number: 20190214340
    Abstract: The disclosure relates to a power module including a semiconductor component configured to be contacted on the top side and the underside. The semiconductor component is configured to be electrically contacted on the top side by a leadframe matrix by contact pressure.
    Type: Application
    Filed: July 7, 2017
    Publication date: July 11, 2019
    Inventors: Michael Leipenat, Christoph Nöth, Ralf Schmidt, Ronny Werner
  • Method for operating power semiconductors
    Patent number: 9748888
    Abstract: A method for operating power semiconductors arranged in converters, includes measuring with a temperature sensor a temperature of at least one of the power semiconductors, performing a comparison of the temperature of the at least one power semiconductor with a reference temperature and providing a result of the comparison; activating a pre-heating phase for preheating the power semiconductors as a function of the result; during the pre-heating phase, defining a pre-heating current; and impressing the pre-heating current into an electrical load.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: August 29, 2017
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Gunnar Dietz, Holger Hoffmann, Harald Hofmann, Michael Leipenat, Stefan Völkel
  • METHOD FOR OPERATING POWER SEMICONDUCTORS
    Publication number: 20160094178
    Abstract: A method for operating power semiconductors arranged in converters, includes measuring with a temperature sensor a temperature of at least one of the power semiconductors, performing a comparison of the temperature of the at least one power semiconductor with a reference temperature and providing a result of the comparison; activating a pre-heating phase for preheating the power semiconductors as a function of the result; during the pre-heating phase, defining a pre-heating current; and impressing the pre-heating current into an electrical load.
    Type: Application
    Filed: September 24, 2015
    Publication date: March 31, 2016
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Gunnar Dietz, HOLGER HOFFMANN, HARALD HOFMANN, MICHAEL LEIPENAT, STEFAN VÖLKEL