Patents by Inventor Michael Lemmer

Michael Lemmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11440310
    Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 13, 2022
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas Steffen Klein, Andreas Hinrich, Michael Schaefer, Yvonne Loewer, Wolfgang Schmitt, Michael Lemmer
  • Publication number: 20200180294
    Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Andreas Steffen Klein, Andreas Hinrich, Michael Schaefer, Yvonne Loewer, Wolfgang Schmitt, Michael Lemmer