Patents by Inventor Michael Lester Wise

Michael Lester Wise has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-adjusting motorcycle windshield
    Patent number: 7281750
    Abstract: A motorcycle comprises a chassis, a windshield attached to the chassis, and a speed sensor operative to determine instantaneous speeds of the motorcycle as the motorcycle travels. In addition, the motorcycle further comprises a position table and a windshield positioning device. The position table associates windshield positions in relation to the chassis with respective speeds of the motorcycle. The windshield positioning device is operative to move the windshield to the windshield positions associated in the position table with the instantaneous speeds of the motorcycle determined by the speed sensor.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: October 16, 2007
    Inventor: Michael Lester Wise
  • Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
    Patent number: 6379222
    Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: April 30, 2002
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corporation
    Inventors: Michael Lester Wise, Jeremy Kaspar Stephens, Suri G. Hedge
  • IMPROVED METHODS AND APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) OF A SEMICONDUCTOR WAFER
    Publication number: 20010046831
    Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
    Type: Application
    Filed: June 14, 1999
    Publication date: November 29, 2001
    Applicant: WISE ET AL
    Inventors: MICHAEL LESTER WISE, JEREMY KASPAT STEPHENS, SURI G. HEDGE
  • Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
    Patent number: 6020262
    Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: February 1, 2000
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corp.
    Inventors: Michael Lester Wise, Jeremy Kaspar Stephens, Suri G. Hedge