Abstract: A Wire Bonder is designed in such a way and equipped with the appropriate means so that in production the current bond cycle is completed in all possible cases such as interruption of the electrical power supply, failure of the compressed air, failure of the vacuum, actuation of the emergency switch, triggering a stop signal caused by the response of a safety mechanism. A bond cycle is to be understood as one single bonding process with which the bond wire is attached to a connection point of the semiconductor chip, formed into a wire loop and attached to a connecting point of the substrate and with which the wire is then tom away from the finished wedge bond.

Abstract: A method and apparatus for controlling a drafting unit for textile slivers. The driving apparatus for the drafting unit is controlled by a main control and at least one auxiliary control. The drafting unit includes an upstream measuring element and a downstream measuring element which deliver measured signals to a central computer unit. A signal representing the inlet sliver cross-section is determined by means of an identification field parameter and by using the downstream measured signal. The identification field parameter is continuously adjusted during operation. A threshold switch is used to control the compensation for irregularities in the incoming sliver.