Abstract: An article and a method of making the article is disclosed where the article includes a sequence of metal layers arranged to inhibit adhesion failure between the metal layers. The metal layers include a topcoat of silver, an intermediate layer of silver, a silver-tin alloy layer and a nickel layer. The layers adhere to a substrate containing copper or copper alloy.

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.

Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Abstract: Nickel electroplating compositions containing copolymers of arginine and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Abstract: Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Abstract: Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Abstract: Environmentally friendly nickel electroplating compositions enable the electroplating of nickel deposits which are bright and uniform and inhibit corrosion of gold layers deposited on the bright and uniform nickel deposits. The environmentally friendly nickel electroplating compositions can be used to electroplate bright and uniform nickel deposits on various substrates over a wide current density range.

Abstract: Environmentally friendly nickel electroplating compositions enable the electroplating of nickel deposits which are bright and uniform and inhibit corrosion of gold layers deposited on the bright and uniform nickel deposits. The environmentally friendly nickel electroplating compositions can be used to electroplate bright and uniform nickel deposits on various substrates over a wide current density range.

Abstract: Nickel electroplating compositions containing copolymers of arginine and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.

Abstract: Environmentally friendly nickel electroplating compositions enable the electroplating of nickel deposits which are bright and uniform and inhibit corrosion of gold layers deposited on the bright and uniform nickel deposits. The environmentally friendly nickel electroplating compositions can be used to electroplate bright and uniform nickel deposits on various substrates over a wide current density range.

Abstract: Environmentally friendly nickel electroplating compositions enable the electroplating of nickel deposits which are bright and uniform and inhibit corrosion of gold layers deposited on the bright and uniform nickel deposits. The environmentally friendly nickel electroplating compositions can be used to electroplate bright and uniform nickel deposits on various substrates over a wide current density range.