Patents by Inventor Michael Lockard

Michael Lockard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080105647
    Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 8, 2008
    Inventors: Michael Lockard, Dannis Smalley, Willa Larsen, Richard Chen
  • Publication number: 20080108221
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 8, 2008
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard, Christopher Bang
  • Publication number: 20080105558
    Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 8, 2008
    Inventors: Adam Cohen, Michael Lockard, Dennis Smalley, Vacit Arat, Christopher Bang, John Dixon
  • Publication number: 20080105355
    Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 8, 2008
    Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
  • Publication number: 20080105646
    Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 8, 2008
    Inventors: Adam Cohen, Michael Lockard, Dale McPherson
  • Publication number: 20080093424
    Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
    Type: Application
    Filed: October 30, 2007
    Publication date: April 24, 2008
    Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
  • Publication number: 20080050524
    Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
    Type: Application
    Filed: April 9, 2007
    Publication date: February 28, 2008
    Inventors: Ananda Kumar, Jorge Albarran, Adam Cohen, Kieun Kim, Michael Lockard, Uri Frodis, Dennis Smalley
  • Publication number: 20070199825
    Abstract: Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., those that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.
    Type: Application
    Filed: January 30, 2007
    Publication date: August 30, 2007
    Inventors: Adam Cohen, Michael Lockard, Dennis Smalley
  • Publication number: 20070158200
    Abstract: Embodiments are directed to electrochemically fabricating multi-layer three dimensional structures where each layer comprises at least one structural and at least one sacrificial material and wherein at least some metals or alloys are electrodeposited during the formation of some layers and at least some metals are deposited during the formation of some layers that are either difficult to electrodeposit and/or are difficult to electrodeposit onto. In some embodiments, the hard to electrodeposit metals (e.g. Ti, NiTi, W, Ta, Mo, etc.) may be deposited via chemical or physical vacuum deposition techniques while other techniques are used in other embodiments. In some embodiments, prior to electrodepositing metals, the surface of the previously formed layer is made to undergo appropriate preparation for receiving an electrodeposited material.
    Type: Application
    Filed: June 29, 2006
    Publication date: July 12, 2007
    Inventors: Adam Cohen, Michael Lockard, Gang Zhang
  • Publication number: 20070045121
    Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
    Type: Application
    Filed: May 16, 2006
    Publication date: March 1, 2007
    Inventors: Adam Cohen, Michael Lockard, Dennis Smalley, Vacit Arat, Christopher Bang, John Dixon
  • Publication number: 20070015367
    Abstract: A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
    Type: Application
    Filed: September 19, 2006
    Publication date: January 18, 2007
    Inventors: Adam Cohen, Dennis Smalley, Michael Lockard, Qui Le
  • Publication number: 20060286829
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: January 3, 2005
    Publication date: December 21, 2006
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard
  • Publication number: 20060226015
    Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
    Type: Application
    Filed: January 3, 2006
    Publication date: October 12, 2006
    Inventors: Dennis Smalley, Adam Cohen, Ananda Kumar, Michael Lockard
  • Publication number: 20060134831
    Abstract: Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.
    Type: Application
    Filed: August 19, 2005
    Publication date: June 22, 2006
    Inventors: Adam Cohen, Vacit Arat, Michael Lockard, Christopher Folk, Marvin Kilgo
  • Publication number: 20060112550
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: July 7, 2005
    Publication date: June 1, 2006
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard, Christopher Bang
  • Publication number: 20060108678
    Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
    Type: Application
    Filed: June 30, 2005
    Publication date: May 25, 2006
    Inventors: Ananda Kumar, Ezekiel Kruglick, Adam Cohen, Kieun Kim, Gang Zhang, Richard Chen, Christopher Bang, Vacit Arat, Michael Lockard, Uri Frodis, Pavel Lembrikov, Jeffrey Thompson
  • Publication number: 20060053625
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: July 7, 2005
    Publication date: March 16, 2006
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard, Christopher Bang
  • Publication number: 20060051948
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: July 7, 2005
    Publication date: March 9, 2006
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard, Christopher Bang
  • Publication number: 20060011486
    Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.
    Type: Application
    Filed: May 26, 2005
    Publication date: January 19, 2006
    Inventors: Michael Lockard, Dennis Smalley, Willa Larsen, Richard Chen
  • Publication number: 20050253606
    Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.
    Type: Application
    Filed: January 3, 2005
    Publication date: November 17, 2005
    Inventors: Kieun Kim, Adam Cohen, Willa Larsen, Richard Chen, Ananda Kumar, Ezekiel Kruglick, Vacit Arat, Gang Zhang, Michael Lockard