Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

Abstract: A workpiece pallet suitable for fixing and transferring workpieces on machine tools is provided with direction-bound guidance on transfer holders. The transfer holders cooperate with a workpiece loading mechanism. The direction-bound guidance devices are located outside the working range of the fixed workpiece or outside the working range of the machining tools belonging to the machine tool. This ensures an all-round accessibility to the fixed workpiece during machining. With the aid of a quick-clamping device, the pallet can be rapidly and precisely used on the machine tool, independently of the workpiece clamping insert. Even in the case of the mass production of items, it is possible to maintain a particularly high precision in the reproduced position of the workpieces and consequently in the machining quality. The pallet can additionally be provided with a controllable waste piece locking system.