Abstract: A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.

Abstract: A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

Abstract: A method of producing an electrode assembly comprises disposing a thermoplastic polymer powder between a first surface of a first electrode and a first surface of a microporous separator to form a separator/electrode pre-assembly; and adhering the first surface of the first electrode to the first surface of the microporous separator via the thermoplastic polymer powder to form a separator/electrode assembly, wherein the adhesive thermoplastic polymer does not form a solid layer.

Abstract: A method of producing an electrode assembly comprises positioning a first adhesive between a first surface of a first electrode layer having a width We1, and a first surface of a microporous separator layer having a width Wm at an edge of the first electrode layer and an edge of the microporous separator layer, to form a first separator/electrode pre-assembly, wherein the first adhesive has a width Wa1 less than ½(Weel); and adhering the first surface of the first electrode layer to the first surface of the microporous separator layer via the adhesive to form a first separator/electrode assembly. The adhesive can be a thermoplastic polymer, and can be a film and/or powder.

Abstract: An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10?6 ohm-cm.

Abstract: A thermoformable polyurethane foam having excellent compression set resistance, and a thermoformable polyurethane foam having excellent compression set resistance and shape retention under load. In another embodiment, at least one additional layer of a polyurethane foam is integrally bonded to the thermoformable foam. A moisture management system for polyurethane foams is also described. The foams have particular utility as shoe sole inserts.

Abstract: A conductive, flame retardant composition is formed from a particulate flame retardant coated with a conductive metal. The composition can provide both conductivity and flame retardance to polymeric compositions such as adhesives, foams, and elastomers.

Abstract: An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10−6 ohm-cm.

Abstract: A thermoformable polyurethane elastomer having excellent compression set resistance, and a thermoformable polyurethane elastomer having excellent compression set resistance and shape retention under load. In another embodiment, at least one additional layer of a polyurethane elastomer is integrally bonded to the thermoformable elastomer. A moisture management system for polyurethane elastomers is also described. The elastomers have particular utility as shoe sole inserts.

Abstract: A thermoformable polyurethane foam having excellent compression set resistance, and a thermoformable polyurethane foam having excellent compression set resistance and shape retention under load. In another embodiment, at least one additional layer of a polyurethane foam is integrally bonded to the thermoformable foam. A moisture management system for polyurethane foams is also described. The foams have particular utility as shoe sole inserts.