Patents by Inventor Michael Lyu
Michael Lyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11031523Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: GrantFiled: June 5, 2018Date of Patent: June 8, 2021Assignees: SYNDIANT INC., XDMICRO (ZHONGSHAN) OPTOELECTRONIC SEMICONDUCTOR CO., LTD.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Patent number: 11031380Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.Type: GrantFiled: June 5, 2018Date of Patent: June 8, 2021Assignees: SYNDIANT INC., XDMICRO (ZHONGSHAN) OPTOELECTRONIC SEMICONDUCTOR CO., LTD.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Patent number: 10403610Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: GrantFiled: June 4, 2018Date of Patent: September 3, 2019Assignee: SYNDIANT INC.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Patent number: 10403613Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: GrantFiled: April 9, 2019Date of Patent: September 3, 2019Assignee: SYNDIANT INC.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Patent number: 10403611Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: GrantFiled: June 4, 2018Date of Patent: September 3, 2019Assignee: SYNDIANT INC.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Patent number: 10403614Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: GrantFiled: April 9, 2019Date of Patent: September 3, 2019Assignee: SYNDIANT INC.Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20190237451Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: ApplicationFiled: April 9, 2019Publication date: August 1, 2019Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20190237450Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: ApplicationFiled: April 9, 2019Publication date: August 1, 2019Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20180358341Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: ApplicationFiled: June 4, 2018Publication date: December 13, 2018Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20180358507Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: ApplicationFiled: June 5, 2018Publication date: December 13, 2018Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20180358343Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.Type: ApplicationFiled: June 5, 2018Publication date: December 13, 2018Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20180358340Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.Type: ApplicationFiled: June 4, 2018Publication date: December 13, 2018Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
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Publication number: 20150306728Abstract: The following description pertains to processing substrates using processes such as, but not limited to, polishing or lapping. Descriptions of systems, methods, and apparatuses according to one or more embodiments of the present invention are presented.Type: ApplicationFiled: April 23, 2014Publication date: October 29, 2015Applicant: SILICON QUEST INTERNATIONAL, INCORPORATEDInventors: Yevsey SENDERZON, Michael LYU
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Publication number: 20140045411Abstract: An aspect of the present invention pertains to a method of fabricating wafers. One embodiment comprises a method of processing a substrate having defects into a wafer. The method comprises grinding the substrate to flatness while supporting the substrate in a grinding apparatus so that there is minimum or substantially zero stress on the substrate. Another aspect of the present invention comprises a substrate holder for holding a substrate as part of grinding processes to produce a flat surface on the substrate.Type: ApplicationFiled: August 10, 2012Publication date: February 13, 2014Inventors: Yevsey SENDERZON, Michael LYU
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Patent number: 5561319Abstract: A CMOS integrated circuit structure is disclosed having a patterned nitride passivation layer, wherein the nitride is patterned such that it does not overlie the thin gate oxide portions of one or more of the MOS devices. When protection against the effects of external radiation is desired, the thin gate oxide areas of the PMOS devices are left uncovered by the patterned nitride passivation layer. When protection is desired against the effects of internally generated "hot electrons", the thin gate oxide areas of the NMOS devices are left uncovered by the patterned nitride passivation layer.Type: GrantFiled: August 30, 1994Date of Patent: October 1, 1996Assignee: LSI Logic CorporationInventors: Alexander H. Owens, Shahin Toutounchi, Abraham Yee, Michael Lyu
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Patent number: 5516731Abstract: A technique for improving the radiation hardness and hot-electron resistance of a CMOS integrated circuit is described whereby undesirable hydrogen ions may be vented through any holes, such as contact holes, in an overlying passivation layer by applying an elevated temperature and/or electrical bias to the integrated circuit die. The elevated temperature and electrical bias serve to accelerate the process by which hydrogen vents from the die. The elimination of unwanted hydrogen significantly reduces threshold shifts in the CMOS integrated circuit, providing greater radiation hardness and hot-electron resistance.Type: GrantFiled: June 2, 1994Date of Patent: May 14, 1996Assignee: LSI Logic CorporationInventors: Shahin Toutounchi, Abraham Yee, Alexander H. Owens, Michael Lyu