Patents by Inventor Michael M. Bishop

Michael M. Bishop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960131
    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Michael J. Bishop, Vijay M. Iyer, Jason S. Pelc, Mario J. Costello
  • Patent number: 11923654
    Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Michael J. Bishop, Jason Pelc, Vijay M. Iyer, Alex Goldis
  • Publication number: 20220082371
    Abstract: The present teachings include a method of measuring an entire film thickness. The method may include forming a polymeric film (10) and measuring the thickness of the film (10) with a camera (20) collecting spatial and spectral images of a plurality of points at one time. The camera may collect a line image from a line of the film. The camera may be a hyperspectral near-infrared camera. In analyzing raw data collected during the measuring step, fringes of the raw data may be corrected using a classical least squares analysis.
    Type: Application
    Filed: January 22, 2020
    Publication date: March 17, 2022
    Inventors: Xiaoyun Chen, Jin Wang, Michael M. Bishop, Christopher M. Thurber, Matthew Benedict, Hyunwoo Kim, Eric L. Marchbanks, Kurt W. Olson