Abstract: In one embodiment, a system includes a wafer and a plurality of contact pads positioned on the wafer. Each contact pad includes a multi-layer stud and a cap layer. The multi-layer stud includes at least a bottom layer and a top layer, the bottom layer being positioned on and extending from an upper surface of the wafer substantially in a direction perpendicular to the upper surface of the wafer, and the top layer being positioned above the bottom layer and substantially extending in the direction perpendicular to the upper surface of the wafer. The cap layer is positioned on the top layer of the multi-layer stud and extends beyond sidewalls of the multi-layer stud substantially in a direction parallel to the upper surface of the wafer. The bottom layer has a larger cross-sectional area than any layer of the multi-layer stud positioned thereabove.

Abstract: In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor. In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor configured to AC couple an electronics ground of the slider to the substrate and DC decouple the electronics ground of the slider from the substrate, the coupling capacitor including: a first conductive layer, a gap layer positioned above the first conductive layer, a dielectric layer positioned above the gap layer and the first conductive layer, and a second conductive layer positioned above the dielectric layer. In another embodiment, a method for forming a capacitor includes forming a substrate, forming a first conductive layer above the substrate, forming a gap layer above the first conductive layer, forming a dielectric layer above the gap layer and the first conductive layer, and forming a second conductive layer above the dielectric layer.

Abstract: In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor. In one embodiment, a slider includes a substrate, a magnetic head, and a coupling capacitor configured to AC couple an electronics ground of the slider to the substrate and DC decouple the electronics ground of the slider from the substrate, the coupling capacitor including: a first conductive layer, a gap layer positioned above the first conductive layer, a dielectric layer positioned above the gap layer and the first conductive layer, and a second conductive layer positioned above the dielectric layer. In another embodiment, a method for forming a capacitor includes forming a substrate, forming a first conductive layer above the substrate, forming a gap layer above the first conductive layer, forming a dielectric layer above the gap layer and the first conductive layer, and forming a second conductive layer above the dielectric layer.