Abstract: A method of forming a semiconductor device is provided. The method includes providing a connector structure configured for carrying a signal and providing a semiconductor die. At least a portion of the connector structure and the semiconductor die are encapsulated with an encapsulant. The semiconductor die is interconnected with the connector structure by way of a conductive trace.

Abstract: A method of forming a semiconductor device is provided. The method includes forming a conductive die connector having a first end connected to a die pad of a semiconductor die. A first encapsulant formulated for selective activation by way of a laser encapsulates at least a portion of the semiconductor die. A first conductive trace of a redistribution layer is formed by plating a conductive material on a first laser activated path on a first major surface of the first encapsulant. The first conductive trace is directly connected to a second end of the die connector. A second encapsulant formulated for selective activation by way of a laser encapsulates at least the first conductive trace and exposed portions of the first major surface of the first encapsulant.

Abstract: A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.

Abstract: A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.

Abstract: A pneumatic flagpole to which a vertically oriented flag is selectively attachable, the flagpole including a vertically elongate wall surrounding an elongate interior space through which air flows vertically upward, the wall having an exterior wall surface over which is positioned a flag selectively attached to the flagpole; and wherein the wall is provided with a plurality of vertically spaced apertures, each of the apertures extending between the interior space and the exterior wall surface, the flag is positioned adjacent to the apertures, and is engaged by air expelled from the interior space through the apertures, whereby the flag is caused to fly.

Abstract: Methods for inactivating bacteria including bacterial spores using an oil-in-water emulsion are provided. The oil-in-water emulsion comprises an oil, a surfactant and an organic phosphate-based solvent. These methods can be used to inactivate a wide variety of bacteria such as Bacillus.

Abstract: The present invention relates to a novel mycoplasma isolated from the urine of patients with AIDS. The mycoplasma has unique morphological and pathobiological properties. The invention also relates to the antigens and antibodies of the novel mycoplasma, and methods of detection utilizing these antigens and antibodies. Antigenically and genetically, the mycoplasma is distinct from all other known mycoplasmas.

Abstract: The present invention relates to a novel mycoplasma isolated from the urine of patients with AIDS. The mycoplasma has unique morphological and pathobiological properties. The invention also relates to the antigens and antibodies of the novel mycoplasma, and methods of detection utilizing these antigens and antibodies. Antigenically and genetically, the mycoplasma is distinct from all other known mycoplasmas. The invention further relates to the DNA sequence of the novel mycoplasma and vaccines against the mycoplasma infection.