Abstract: A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

Abstract: A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

Abstract: A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.

Abstract: A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

Abstract: Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Abstract: A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.