Patents by Inventor Michael M. Ohadi

Michael M. Ohadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230284418
    Abstract: A manifold-microchannel (MMC) heat sink can comprise a plurality of microchannels and a manifold. The microchannels can be segregated into successive heat transfer stages. The manifold can include at least one connecting channel and at least one vapor permeable membrane portion. Each connecting channel can fluidically couple one of the heat transfer stages to a successive heat transfer stage. Each vapor permeable membrane portion can allow coolant in a vapor phase to pass therethrough while retaining coolant in a liquid phase within the corresponding connecting channel. A vapor quality of the coolant exiting from one of the heat transfer stages into a connecting channel can be greater than a vapor quality of the coolant entering the successive heat transfer stage from the same connecting channel.
    Type: Application
    Filed: February 3, 2023
    Publication date: September 7, 2023
    Inventors: Raphael Kahat MANDEL, Michael M. OHADI
  • Patent number: 11491705
    Abstract: In a metal fiber composite (MFC) additive manufacturing (AM) method, a layer of polymer structures is deposited using a fused filament fabrication (FFF) printer assembly comprising at least one nozzle. Subsequently, an MFC printer assembly is used to embed a continuous metal fiber into one or more of the polymer structures of the layer. The embedding is achieved by heating the metal fiber and applying pressure to the metal fiber using an embedding surface of the MFC printer assembly. The heated metal fiber melts polymer adjacent thereto, thereby allowing the pressure to embed the metal fiber into the polymer structure. Using the MFC-AM method, various composite structures can be formed, such as novel heat exchangers that may otherwise be difficult or impossible to fabricate via other manufacturing techniques.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: November 8, 2022
    Assignee: UNIVERSITY OF MARYLAND, COLLEGE PARK
    Inventors: David M. Hymas, Serguei V. Dessiatoun, Michael M. Ohadi
  • Patent number: 11002497
    Abstract: Multi-stage microchannel heat and/or wherein said heat and/or mass transfer system includes a system selected from a group of heat exchanger, mass transfer system, and combination thereof, mass transfer system attains an enhanced heat transfer, low pressure drop, and optimized flow distribution and stability for a single- and two-phase applications by combining microchannels formed on industrially available fin tubes, and a multi-stage flow distributing manifold, and directing the flow of a heat exchanging medium through multiple passes formed by short length of respective microchannels, while controllably by-passing some microchannels when migrating the flow of the heat exchanging medium from the microchannels into multiple mixing stages provided by a specific configuration of the manifold.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: May 11, 2021
    Assignee: University ot Maryland, College Park
    Inventors: Ratnesh Tiwari, Serguei V. Dessiatoun, Michael M. Ohadi, Ebrahim Al Hajri
  • Publication number: 20200016823
    Abstract: In a metal fiber composite (MFC) additive manufacturing (AM) method, a layer of polymer structures is deposited using a fused filament fabrication (FFF) printer assembly comprising at least one nozzle. Subsequently, an MFC printer assembly is used to embed a continuous metal fiber into one or more of the polymer structures of the layer. The embedding is achieved by heating the metal fiber and applying pressure to the metal fiber using an embedding surface of the MFC printer assembly. The heated metal fiber melts polymer adjacent thereto, thereby allowing the pressure to embed the metal fiber into the polymer structure. Using the MFC-AM method, various composite structures can be formed, such as novel heat exchangers that may otherwise be difficult or impossible to fabricate via other manufacturing techniques.
    Type: Application
    Filed: October 6, 2017
    Publication date: January 16, 2020
    Inventors: David M. HYMAS, Serguei V. DESSIATOUN, Michael M. OHADI
  • Patent number: 7159646
    Abstract: An electrohydrodynamically enhanced heat transfer system (EHD) includes an electrode completely encapsulated in an insulating material and coupled to a power supply to generate an electric field between a heat transfer surface and the encapsulated electrode when energized for interacting with the heat exchange surface and the working media to reduce frost formation on the heat transfer surface and to enhance heat transfer. The power supply may be completely encapsulated and immersed into the working media. In order to reduce accumulation of condensed liquid onto the electrode, the surface of the insulating material of the encapsulated electrode is either covered with a water repellent, or heated a few degrees above the dew point temperature of the air surrounding the heat transfer surface. The encapsulated electrode can be energized by an AC or DC electric field through a controlling switch.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: January 9, 2007
    Assignee: University of Maryland
    Inventors: Serguei V. Dessiatoun, Igor Ivakhnenko, Michael M. Ohadi
  • Patent number: 7108056
    Abstract: Cooling means for a heated surface comprising an enclosure for enclosing the heated surface and two oppositely charged interleaved radial arrays of microelectrodes positioned on the surface within the enclosure. The combined arrays have a closely spaced end and a periphery end. A volatile cooling liquid is contained in a reservoir within the enclosure but separate from the array. A slit-type restrictor is positioned between the reservoir and the array to restrict liquid flow from the reservoir toward the array. A portion of the closely spaced end of the array is positioned within the slit whereby the pumping action of the array draws only the amount of volatile liquid along the electrodes needed to form a thin evaporating film over the array area. The vapor from the thin film evaporator flows to a condenser where it is cooled, condensed to a liquid and returned to the liquid reservoir.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: September 19, 2006
    Assignee: Atec Advanced Thermal and Environmental Concepts
    Inventors: Saeed Moghaddam, Michael M. Ohadi
  • Patent number: 6888721
    Abstract: Means for cooling a heated surface comprising an enclosure for enclosing the heated surface and two interleaved radial arrays of micro electrodes positioned on the surface within the enclosure thereby forming an interleaved radial array. The radial array has a ‘near-vertex’ end and a periphery. The micro electrodes at the near-vertex end have a smaller interelectrode distance and the micro electrodes at the periphery have a larger interelectrode distance. A volatile cooling liquid is contained within the enclosure and moved from the near-vertex array end toward the periphery along the lengths of micro electrodes by non-alternating voltages applied to the micro electrodes, thereby creating a polarization effect and evaporation of the volatile liquid.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 3, 2005
    Assignee: Atec Corporation
    Inventors: Saeed Moghaddam, Michael M. Ohadi
  • Publication number: 20030203245
    Abstract: An electrohydrodynamically enhanced heat transfer system (EHD) and method takes advantage of an electrode completely encapsulated in an insulating material and coupled to a power supply to generate an electric field between a heat transfer surface and the encapsulated electrode when energized for interacting with the heat exchange surface and the working media to reduce frost formation on the heat transfer surface, thereby enhancing heat transfer therebetween. For certain applications of the EHD enhanced heat transfer technique with the encapsulated electrode, the power supply is completely encapsulated and can be immersed into the working media. In order to reduce accumulation of condensed liquid onto the electrode, the surface of the insulating material of the encapsulated electrode is either covered with a water repellent, or heated a few degrees above the dew point temperature of the air surrounding the heat transfer surface.
    Type: Application
    Filed: April 15, 2003
    Publication date: October 30, 2003
    Inventors: Serguei V. Dessiatoun, Igor Ivakhnenko, Michael M. Ohadi
  • Patent number: 6582500
    Abstract: A device for separating liquid particles from an entraining gas or vapor stream. The device employs mechanical centrifugal forces to concentrate liquid droplets in a limited space for further extraction from the gas flow using an electrical field and an electrically charged collecting surface whereby the particles are attracted to and deposited on the surface for further extraction by the gas flow without reintrainment of the liquid back into the vapor stream. The device is constructed to provide an area of low gas velocity for removing the liquid from the device.
    Type: Grant
    Filed: August 11, 2001
    Date of Patent: June 24, 2003
    Assignee: University of Maryland
    Inventors: Michael M Ohadi, Serguei V. Dessiatoun, Igor Ivakhnenko
  • Publication number: 20020122728
    Abstract: A cooling system employing Micro Electro Mechanical System (MEMS) technology and polarization principles to move a cooling fluid over a surface requiring cooling and further employing electrohydrodynamic principles for the purpose of enhancing the heat transfer coefficient between the cooling fluid and the surface to be cooled.
    Type: Application
    Filed: March 2, 2001
    Publication date: September 5, 2002
    Inventors: Jafar Darabi, Michael M. Ohadi
  • Patent number: 6443704
    Abstract: A cooling system employing Micro Electro Mechanical System (MEMS) technology and polarization principles to move a cooling fluid over a surface requiring cooling and further employing electrohydrodynamic principles for the purpose of enhancing the heat transfer coefficient between the cooling fluid and the surface to be cooled.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: September 3, 2002
    Inventors: Jafar Darabi, Michael M. Ohadi
  • Patent number: 5769155
    Abstract: An apparatus for electrohydrodynamic augmentation of heat transfer with a working fluid comprising a heat transfer surface, said surface being formed with fins extending from a side of said surface in contact with the working fluid, said fins defining at least one channel having confronting sidewalls; an elongated, electrically conductive electrode disposed in the channel in relatively closely spaced relation between the sidewalls for carrying a current and producing an electric field for interacting with the working fluid to enhance heat exchange with the surface. At least one insulator disposed for engaging the channel in longitudinal spaced apart locations therealong.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: June 23, 1998
    Assignee: University of Maryland
    Inventors: Michael M. Ohadi, Serguei V. Dessiatoun