Patents by Inventor Michael M. Ryl

Michael M. Ryl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silver/tin electroplating bath and method of using the same
    Patent number: 11643742
    Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
    Type: Grant
    Filed: February 2, 2022
    Date of Patent: May 9, 2023
    Assignee: MacDermid Enthone Inc.
    Inventors: Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
  • Silver/Tin Electroplating Bath and Method of Using the Same
    Publication number: 20220170172
    Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
    Type: Application
    Filed: February 2, 2022
    Publication date: June 2, 2022
    Inventors: Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
  • Silver/tin electroplating bath and method of using the same
    Patent number: 11280014
    Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 22, 2022
    Assignee: MacDermid Enthone Inc.
    Inventors: Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl
  • Silver/Tin Electroplating Bath and Method of Using the Same
    Publication number: 20210381121
    Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.
    Type: Application
    Filed: June 5, 2020
    Publication date: December 9, 2021
    Inventors: Fengting Xu, Jean W. Chevalier, Ernest Long, Richard A. Bellemare, Michael M. Ryl