Abstract: A switch includes first and second transistors electrically connected in series between the switch's first and second terminals. Each of the first and second transistors includes first and second transistor terminals between which electrical current can flow. A first metal bus bar includes a first channel through which fluid can flow. A second metal bus bar includes a second channel through which fluid can flow. The first transistor terminals of the first and second transistors are electrically connected to the first and second metal bus bars, respectively. A first driver circuit controls the first transistor. A second driver circuit controls the second transistor. A control unit can generate a first signal. A first distribution network can transmit the first signal to the first and second drivers at the same time.

Abstract: An apparatus for electrically connecting and disconnecting a power converter to a voltage supply. The apparatus may include a first bus bar configured for electrical connection to the power converter, a first tube received in the first bus bar, wherein the first tube extends between a first end and a second end, wherein the first tube is configured to electrically insulate fluid flowing through it from the first bus bar, a second bus bar, a second tube received in the second bus bar, wherein the second tube extends between first and second ends, wherein the second tube is configured to electrically insulate fluid flowing through it from the second bus bar, and a first switch electrically connected between the first and second bus bars.

Abstract: A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.

Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.

Abstract: Structures in the nanoscale and mesoscale domain are provided. The structures typically have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics.

Abstract: A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.

Abstract: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.