Patents by Inventor Michael Marek
Michael Marek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958361Abstract: A military vehicle includes an engine, an energy storage system, an accessory drive coupled to the engine and including an air compressor and a first motor, a second motor coupled to an axle, and a clutch positioned between the engine and the second motor. The clutch is spring-biased into engagement with the engine and pneumatically disengaged by an air supply selectively provided thereto based on operation of the air compressor. In an engine mode, (i) the clutch does not receive the air supply such that the engine is coupled to the second motor and (ii) the engine drives (a) the accessory drive and (b) the axle through the second motor. In the electric mode, (i) the first motor drives the air compressor to compress air to facilitate supplying the air supply to the clutch to disengage the clutch and decouple the engine from the second motor and (ii) the second motor drives the axle.Type: GrantFiled: September 1, 2022Date of Patent: April 16, 2024Assignee: Oshkosh Defense, LLCInventors: Chad Smith, Dave Marek, Neil Dekarske, Mike Bolton, Ryan Crabtree, Joseph Dehaan, Rachell Harsh, Michael Koenigs, Shawn Naglik, Mitchel Nordahl, Evan Schertz, Mikel Ullman, Jessica Szymanski, Bradon Zeitler, Deepak Shukla, Ed Trinklein, Tim Voight, Mike Yanacek, Matt Mathison, Nader Nasr
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Patent number: 11962233Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.Type: GrantFiled: May 1, 2023Date of Patent: April 16, 2024Assignee: Skyworks Solutions, Inc.Inventors: Michael Robert May, Fernando Naim Lavalle Aviles, Carlos Jesus Briseno-Vidrios, Patrick Johannus De Bakker, Gabor Marek, Charles Guo Lin, Peter Onody, Tamas Marozsak, Andras V. Horvath
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Publication number: 20240069527Abstract: A thermal management system for an energy storage system for an aircraft includes a pump circulating a thermal management fluid through the thermal management system and an energy storage device of the aircraft. A controller circuitry may control a variable pumping capacity of the pump based on sensing pressure or temperature of the thermal management fluid at the energy storage device. The controller circuitry may default operation of the pump to a first pumping capacity in response to the pressure or temperature being within a predetermined operating range and a predetermined failure condition or a power demand of an aircraft engine supply bus exceeding a predetermined threshold. The controller controlling operation of the pump to a second pumping capacity in response to absence of the power demand signal of the aircraft engine supply bus and the pressure or temperature being within the predetermined operating range.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Applicant: Rolls-Royce CorporationInventors: Stephen Andrew LONG, Michael DOUGHERTY, Tomasz Marek LUBECKI, Firman SASONGKO, Chandana Jayampathi Gajanayake
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Patent number: 11716066Abstract: A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.Type: GrantFiled: December 8, 2021Date of Patent: August 1, 2023Assignee: KYOCERA AVX Components CorporationInventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20230235766Abstract: The present aspects include an adhesive and mechanically bonded adapter or node. The adapter or node comprises a connection member, including: an outer wall extending in a first direction from a first proximal end to a first distal end; an inner wall extending within the outer wall, in the first direction, from a second proximal end to a second distal end; and a base wall extending from an inner surface of the outer wall to an outer surface of the inner wall between the first proximal end and the second proximal end; and wherein the outer wall, the inner wall, and the base wall define a space having a distance between the outer wall and the inner wall that varies in the first direction, wherein the space is configured to fixedly position an end portion of a tube inserted into the space such that the end portion is fixed to the inner surface of the outer wall and the outer surface of the inner wall.Type: ApplicationFiled: January 24, 2023Publication date: July 27, 2023Inventor: Michael Marek GRABIS
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Patent number: 11652265Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.Type: GrantFiled: March 3, 2021Date of Patent: May 16, 2023Assignee: KYOCERA AVX Components CorporationInventors: Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill
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Publication number: 20230006326Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.Type: ApplicationFiled: September 2, 2022Publication date: January 5, 2023Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20220416385Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.Type: ApplicationFiled: August 24, 2022Publication date: December 29, 2022Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Patent number: 11437695Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.Type: GrantFiled: March 6, 2020Date of Patent: September 6, 2022Assignee: KYOCERA AVX Components CorporationInventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Patent number: 11431069Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.Type: GrantFiled: February 19, 2020Date of Patent: August 30, 2022Assignee: KYOCERA AVX Components CorporationInventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20220190802Abstract: A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.Type: ApplicationFiled: December 8, 2021Publication date: June 16, 2022Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20220165491Abstract: A surface mountable thin-film coupler may include a monolithic base substrate and a plurality of ports formed over the monolithic base substrate. The surface mountable thin-film coupler may include at least one thin-film component connected with at least one port of the plurality of ports. The surface mountable thin-film coupler may provide a coupling factor that is greater than ?5 dB and less than ?1 dB over a coupling frequency range having a lower bound that is greater than 1 GHz and an upper bound that is at least 200 MHz greater than the lower bound. A footprint of the coupler may be less than about 3 mm2.Type: ApplicationFiled: November 23, 2021Publication date: May 26, 2022Inventors: Michael Marek, Elinor O'Neill, Arie Leonid Talalaevsky, Nahum Bohmstein
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Publication number: 20220014163Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.Type: ApplicationFiled: August 27, 2021Publication date: January 13, 2022Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Patent number: 11108368Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.Type: GrantFiled: March 4, 2020Date of Patent: August 31, 2021Assignee: AVX CorporationInventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20210184327Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.Type: ApplicationFiled: March 3, 2021Publication date: June 17, 2021Inventors: Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill
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Patent number: 10944147Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.Type: GrantFiled: February 27, 2019Date of Patent: March 9, 2021Assignee: AVX CorporationInventors: Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill
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Publication number: 20200295727Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.Type: ApplicationFiled: March 4, 2020Publication date: September 17, 2020Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20200295432Abstract: A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.Type: ApplicationFiled: March 6, 2020Publication date: September 17, 2020Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20200280114Abstract: A high frequency, stripline filter may have a bottom surface for mounting to a mounting surface. The filter may include a monolithic base substrate having a top surface and a plurality of thin-film microstrips, including a first thin-film microstrip and a second thin-film microstrip, formed over the top surface of the substrate. Each of the plurality of thin-film microstrips may have a first arm, a second arm parallel to the first arm, and a base portion connected with the first and second arms. A port may be exposed along the bottom surface of the filter. A conductive path may include a via formed in the substrate. The conductive path may electrically connect the first thin-film microstrip with the port on the bottom surface of the filter. The filter may exhibit an insertion loss that is greater than ?3.5 dB at a frequency that is greater than about 15 GHz.Type: ApplicationFiled: February 19, 2020Publication date: September 3, 2020Inventors: Michael Marek, Elinor O'Neill, Ronit Nissim
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Publication number: 20190280361Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.Type: ApplicationFiled: February 27, 2019Publication date: September 12, 2019Inventors: Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill