Abstract: A method for coating a multi-layered polymer film is disclosed including coating a first layer of polyimide onto a carrier, curing the first layer of polyimide by subjecting the first layer of polyimide to an elevated temperature, depositing a first layer of metal onto the cured first layer of polyimide, coating a second layer of polyimide onto the first layer of metal, and curing the second layer of polyimide by subjecting the second layer of polyimide to an elevated temperature. A flexible electronic device is also disclosed, including multiple interposed layers of polyimide and layers of metal, a dielectric barrier layer disposed on the top layer of polyimide, and a thin film transistor-based device disposed on the dielectric barrier layer. The flexible electronic device has little to no curl.

Abstract: Processes for conditioning a dry tailings material from a non-aqueous extraction (NAE) process for extracting bitumen from oil sands ore are described. The process can include contacting a main stream of the dry tailings material with a re-wetted tailings seed stream to produce a combined tailings material, and subjecting the combined tailings material to re-wetting to produce a re-wetted tailings material. The re-wetting can include adding a wetting agent to the combined tailings material, and imparting mixing to the combined tailings material. Contacting the main stream of the dry tailings material with the re-wetted tailings seed stream can include recycling a portion of the re-wetted tailings material to the main stream of the dry tailings material as the re-wetted tailings seed stream to produce the combined tailings material, or subjecting a sub-stream of the dry tailings material to sub-stream re-wetting to produce the re-wetted tailings seed stream.

Abstract: Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

Abstract: Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

Abstract: Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

Abstract: In a system for facilitating real estate events between real estate transaction participants via a global computer network, a lender computer is in data communication with the global computer network and receives a loan pre-approval request from a buyer/borrower and generates an associated contact record. A loan officer computer is in data communication with the global computer network and is associated with the selected loan officer. The loan officer computer is programmed to receive the buyer/borrower contact record from the lender computer. A central server receives a copy of the buyer/borrower contact record and selects a real estate agent from a list of associated real estate agents. The central server generates real estate agent notifications indicating that the selected real estate agent is assigned to the buyer/borrower contact record and transmits the real estate agent notification to the selected real estate agent, the buyer/borrower and the selected loan officer.

Abstract: Some embodiments include an electronic device. The electronic device includes a first scintillator layer, a transistor, and one or more device elements over the transistor, and the one or more device elements include a photodetector. Meanwhile, the first scintillator layer is monolithically integrated with at least one of the transistor or the one or more device elements. Other embodiments of related systems, devices, and methods are also disclosed.

Abstract: The present invention relates generally to systems and methods for delivering content from content providers to end users using computer networks. Aspects of the invention enable content providers cost-effective content delivery using, for example, download and peer-to-peer mechanisms, while also allowing content providers the ability to control and restrict usage of the content and combat piracy. These and other aspects of the invention are discussed in more detail herein.

Abstract: Some embodiments include an imaging system. The imaging system includes an active matrix pixel array having a flexible substrate and a pixel. The pixel includes a transistor over the flexible substrate, and the transistor includes multiple active layers having a first active layer and a second active layer over the first active layer. Further, the active matrix pixel array also includes a photodiode over the transistor, and the photodiode includes an N-type layer over the transistor, an I layer over the N-type layer, and a P-type layer over the I layer. Meanwhile, the imaging system also includes a flexible scintillator layer over the active matrix pixel array. Other embodiments of related systems and methods are also disclosed.

Abstract: Some embodiments include an imaging system. The imaging system includes an active matrix pixel array having a flexible substrate and a pixel. The pixel includes a transistor over the flexible substrate, and the transistor includes multiple active layers having a first active layer and a second active layer over the first active layer. Further, the active matrix pixel array also includes a photodiode over the transistor, and the photodiode includes an N-type layer over the transistor, an I layer over the N-type layer, and a P-type layer over the I layer. Meanwhile, the imaging system also includes a flexible scintillator layer over the active matrix pixel array. Other embodiments of related systems and methods are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a semiconductor device. The semiconductor device includes a transistor having a gate metal layer, a transistor composite active layer, and one or more contact elements over the transistor composite active layer. The transistor composite active layer includes a first active layer and a second active layer, the first active layer is over the gate metal layer, and the second active layer is over the first active layer. Meanwhile, the semiconductor device also includes one or more semiconductor elements forming a diode over the transistor. The semiconductor element(s) have an N-type layer over the transistor, an I layer over the N-type layer, and a P-type layer over the I layer. Other embodiments of related systems and methods are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a semiconductor device. The semiconductor device includes a transistor having a gate metal layer, a transistor composite active layer, and one or more contact elements over the transistor composite active layer. The transistor composite active layer includes a first active layer and a second active layer, the first active layer is over the gate metal layer, and the second active layer is over the first active layer. Meanwhile, the semiconductor device also includes one or more semiconductor elements forming a diode over the transistor. The semiconductor element(s) have an N-type layer over the transistor, an I layer over the N-type layer, and a P-type layer over the I layer. Other embodiments of related systems and methods are also disclosed.

Abstract: Some embodiments include an imaging system. The imaging system includes an active matrix pixel array having a flexible substrate and a pixel. The pixel includes a transistor over the flexible substrate, and the transistor includes multiple active layers having a first active layer and a second active layer over the first active layer. Further, the active matrix pixel array also includes a photodiode over the transistor, and the photodiode includes an N-type layer over the transistor, an I layer over the N-type layer, and a P-type layer over the I layer. Meanwhile, the imaging system also includes a flexible scintillator layer over the active matrix pixel array. Other embodiments of related systems and methods are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Abstract: The present invention relates generally to systems and methods for delivering content from content providers to end users using computer networks. Aspects of the invention enable content providers cost-effective content delivery using, for example, download and peer-to-peer mechanisms, while also allowing content providers the ability to control and restrict usage of the content and combat piracy. These and other aspects of the invention are discussed in more detail herein.

Abstract: The present invention relates generally to systems and methods for delivering content from content providers to end users using computer networks. Aspects of the invention enable content providers cost-effective content delivery using, for example, download and peer-to-peer mechanisms, while also allowing content providers the ability to control and restrict usage of the content and combat piracy. These and other aspects of the invention are discussed in more detail herein.

Abstract: The present invention relates generally to systems and methods for delivering content from content providers to end users using computer networks. Aspects of the invention enable content providers cost-effective content delivery using, for example, download and peer-to-peer mechanisms, while also allowing content providers the ability to control and restrict usage of the content and combat piracy. These and other aspects of the invention are discussed in more detail herein.