Patents by Inventor Michael Mauk

Michael Mauk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8691592
    Abstract: Disclosed are mechanically-actuated devices for transporting fluids within a microfluidic circuit and performing diagnostic operations on a sample. Also disclosed are related methods for performing sample analysis effected by the motion of an actuator proximate to a microfluidic system.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: April 8, 2014
    Assignee: The Trustees Of The University Of Pennsylvania
    Inventors: Zongyuan Chen, Haim H. Bau, Michael Mauk, Xianbo Qiu, Jason Kwa
  • Publication number: 20080280285
    Abstract: Disclosed are methods, devices and systems for biological and chemical sample processing using microfluidic chips. The disclosed microfluidic chips contain at least two detection zones for interacting with pre-selected RNA sequences, DNA sequences, antibodies, or antigens to determine their presence in the sample. Systems are also described comprising a cassette having at least one port and a sample inlet in fluid communication with a detection zone for interacting with pre-selected RNA sequences, DNA sequences, antibodies, or antigens, or mixtures thereof, if present, in a sample. Methods for concurrent testing of at least two of RNA, DNA, antibody, and antigen in a sample are also described, as are methods for testing for pre-selected pathogens and microfluidic methods.
    Type: Application
    Filed: November 9, 2007
    Publication date: November 13, 2008
    Inventors: Zongyuan G. Chen, Jing Wang, Michael Mauk, Haim H. Bau, Daniel Malamud, William Abrams, Raymond Niedbala, Hendrikus Johannes Tanke, Paul L.A.M. Corstjens
  • Publication number: 20050054185
    Abstract: A structure comprising at least one layer of germanium formed on a surface of a ceramic substrate. The layer of germanium has a thickness of not larger than 10 microns and includes grains having grain size of at least 0.05 mm. Also, a structure comprising at least one layer of germanium formed on a surface of a ceramic substrate, and at least one capping layer formed on a surface of the layer of germanium. Also, a method of forming a thin film germanium structure, comprising forming at least one layer of germanium on a surface of a ceramic substrate, then forming at least one capping layer on a surface of the layer of germanium, followed by heating and then cooling the layer of germanium.
    Type: Application
    Filed: October 21, 2004
    Publication date: March 10, 2005
    Applicant: GE ENERGY (USA) LLC
    Inventor: Michael Mauk