Patents by Inventor Michael Mingliang Liu

Michael Mingliang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power Envelope Analysis for the Thermal Optimization of Multi-Chip Modules
    Publication number: 20240037308
    Abstract: A semiconductor device is made by calculating a thermal resistance matrix for the semiconductor device. A plurality of maximum junction temperatures for the plurality of die of the semiconductor device is selected. A plurality of power envelope surfaces are calculated for the semiconductor device based on the thermal resistance matrix and the maximum junction temperatures. A plurality of powers is selected for the plurality of die. The plurality of powers are compared against the plurality of power envelope surfaces to determine a plurality of risk values.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Chien Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Mingliang Liu