Abstract: For one embodiment, a reflection is reduced to substantially zero regardless of a wavelength of incident light that produced the reflection.

Abstract: A light modulator device includes a bottom charge plate; a pixel plate supported by at least one flexure, wherein the flexure is located substantially below said pixel plate, and a top charge plate.

Abstract: A light modulator device includes a bottom charge plate; a pixel plate supported by at least one flexure, wherein the flexure is located substantially below said pixel plate, and a top charge plate.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A spatial light modulator includes a first region and a second region. A light-absorbing layer contacts at least a portion of the second region. The light absorbing layer includes a first layer and a second layer, the second layer having a reflectivity less than about 75%.

Abstract: A micro electromechanical system (MEMS) mirror, comprising a displaceable hinged member, a mirror plate, and a plurality of mirror support elements. The mirror plate has a planar mirror face affixed thereto. The plurality of mirror support elements extend between the displaceable hinged member and the mirror plate.

Abstract: A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an actuating area for the MEMS device on the dielectric layer, including depositing a conductive material on the dielectric layer and communicating the conductive material with the at least one conductive layer of the substructure through the dielectric layer, forming a sacrificial layer over the conductive material and the dielectric layer, including depositing silicon over the conductive material and the dielectric layer, and forming a substantially planar surface of the silicon, forming an actuating element over the sacrificial layer within the actuating area, including communicating the actuating element with the conductive material of the actuating area through the sacrificial layer, and substantially removing the sacrificial layer between the ac

Abstract: A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially planar surface of the first sacrificial layer, and forming a first element over the substantially planar surface of the first sacrificial layer, including communicating the first element with the conductive material through the first sacrificial layer. In addition, the method includes forming a second sacrificial layer over the first element, including forming a substantially planar surface of the second sacrificial layer, forming a support through the second sacrificial layer to the first element after forming the second sacrificial layer, including, filling the support, and forming a second element over the support and the substantially planar surface of the second sacrificial layer.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an actuating area for the MEMS device on the dielectric layer, including depositing a conductive material on the dielectric layer and communicating the conductive material with the at least one conductive layer of the substructure through the dielectric layer, forming a sacrificial layer over the conductive material and the dielectric layer, including depositing silicon over the conductive material and the dielectric layer, and forming a substantially planar surface of the silicon, forming an actuating element over the sacrificial layer within the actuating area, including communicating the actuating element with the conductive material of the actuating area through the sacrificial layer, and substantially removing the sacrificial layer between the ac

Abstract: A method of planarizing a semiconductor wafer includes applying a CMP process to a layer of dielectric material to planarize the wafer surface, and applying a plasma etching process to the wafer surface until a signal is generated from a detection layer that indicates that said detection layer has been removed from underlying features disposed on the water.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming a trench in the first side of the substrate, forming a mask layer within the trench, forming at least one hole in the mask layer, filling the trench and the at least one hole, forming a first portion of the opening in the substrate from the second side of the substrate to the mask layer, and forming a second portion of the opening in the substrate from the second side of the substrate through the at least one hole in the mask layer to the first side of the substrate.

Abstract: A saw arrangement includes the combination of a circular saw blade and a lubricating guide support assembly. The circular saw blade includes a saw plate having openings formed therein and carbide insert teeth disposed circumferentially about the saw plate. The lubricating guide support assembly includes two guide supports each having a bearing surface disposed immediately adjacent opposite sides of the saw plate at a spacing to the cutting area for proper alignment of the saw blade during cutting. At least one of the guide supports includes a recessed area containing liquid exposed to the saw plate whereat a thin film of the liquid is applied to the saw plate as it passes by the recessed area during cutting. The openings are arranged on the saw plate to pass by the recessed area and are dimensioned to receive liquid therein for transport away from the recessed area.

Abstract: A saw blade has a saw body and a cutting edge for cutting during movement of the saw blade. A lubricating guide support has a bearing surface disposed immediately adjacent the saw body for proper alignment of the saw blade during cutting. The guide support contains liquid exposed to the saw body at the bearing surface. The saw body defines a plurality of cavities whereby the liquid is applied to the saw body as it passes by the bearing surface during movement of the saw blade. Each one of the cavities is arranged to pass by the exposed liquid and is dimensioned to receive liquid therein for transport. The saw body has an axial thickness no greater than 0.08 inches. The liquid transport cavity has a triangular cross-section with a trailing edge oriented at an approximate negative 5 degrees to a radius of the saw body.

Abstract: A saw arrangement includes the combination of a circular saw blade and a lubricating guide support assembly. The circular saw blade includes a saw plate having openings formed therein and carbide insert teeth disposed circumferentially about the saw plate. The lubricating guide support assembly includes two guide supports each having a bearing surface disposed immediately adjacent opposite sides of the saw plate at a spacing to the cutting area for proper alignment of the saw blade during cutting. At least one of the guide supports includes a recessed area containing liquid exposed to the saw plate whereat a thin film of the liquid is applied to the saw plate as it passes by the recessed area during cutting. The openings are arranged on the saw plate to pass by the recessed area and are dimensioned to receive liquid therein for transport away from the recessed area.

Abstract: A saw arrangement includes the combination of a circular saw blade and a lubricating guide support assembly. The circular saw blade includes a saw plate having openings formed therein and carbide insert teeth disposed circumferentially about the saw plate. The lubricating guide support assembly includes two guide supports each having a bearing surface disposed immediately adjacent opposite sides of the saw plate at a spacing to the cutting area for proper alignment of the saw blade during cutting. At least one of the guide supports includes a recessed area containing liquid exposed to the saw plate whereat a thin film of the liquid is applied to the saw plate as it passes by the recessed area during cutting. The openings are arranged on the saw plate to pass by the recessed area and are dimensioned to receive liquid therein for transport away from the recessed area.

Abstract: An improved pair of socks is disclosed for human feet. The improvement comprises providing a distinctive color indicator on each sock of the pair, in a location that will be covered by the shoe of the wearer, to facilitate pairing of the socks which comprise the pair, wherein the color of the indicator is selected so as to be capable of distinguishing the socks of the pair from other socks of similar or like color and of the same size. A process is also disclosed for making pairs of socks of a predetermined size including a color indicator for facilitating pairing of socks.

Abstract: An apparatus and a method for introducing a particulate matter along with a driving liquid, such as water, into a ground surface. The apparatus is also highly effective for perforating and thereby aerating the ground surface. The particulate matter may preferably adopt the form of a powder like substance often referred to as "polymer" and which is injected into the ground for purposes of acting as a plant food or a plant additive in various agricultural operations. The apparatus utilizes an injector device for mixing the polymer or other particulate matter with the driving liquid, such as water, at a point in close proximity to the ground surface so that there is no pre-mixing of the particulate matter and the driving liquid. The driving liquid is pumped to the injector at a high pressure and introduced into a high pressure chamber of the injector. The liquid is then forced through a very small diameter nipple opening leading to a low-pressure chamber.