Abstract: Described herein are integrated circuit devices that include conductive structures formed by direct bonding of different components, e.g., direct bonding of two dies, or of a die to a wafer. The conductive structures are formed from a top metallization layer of each of the components. For example, elongated conductive structures at the top metallization layer may be patterned and bonded to form large interconnects for high-frequency and/or high-power signals. In another example, the bonded conductive structures may form radio frequency passive devices, such as inductors or transformers.

Abstract: Waveguide structures are built into integrated circuit devices using standard processing steps for semiconductor device fabrication. A waveguide may include a base, a top, and two side walls. At least one of the walls (e.g., the base or the top) may be formed in a metal layer. The base or top may be patterned to provide a transition to a planar transmission line, such as a coplanar waveguide. The side walls may be formed using vias.

Abstract: Integrated capacitors are described. In an example, an integrated capacitor structure includes alternating first metal lines and second metal lines in a dielectric layer of a metallization layer in a stack of metallization layers, the first metal lines coupled together, and the second metal lines coupled together. A metal plate is over or beneath the alternating first metal lines and second metal lines. A dielectric liner layer is between the alternating first metal lines and second metal lines and the metal plate.

Abstract: Integrated capacitors are described. In an example, an integrated capacitor structure includes alternating first metal lines and second metal lines in a dielectric layer of a metallization layer in a stack of metallization layers, the first metal lines coupled together, and the second metal lines coupled together. A metal plate is over or beneath the alternating first metal lines and second metal lines. The metal plate is coupled to the first metal lines or the second metal lines by vias.

Abstract: Systems and methods are provided for reducing or minimizing fouling within the primary fractionator of a pyrolysis reaction system. The reduced or minimized fouling can be achieved in part by providing one or more pump-around trays in the primary fractionator below the level of the fractionation trays for an intermediate product produced by the fractionator. Including a pump-around section below the fractionation trays can improve vapor distribution within the fractionation trays, which are believed to have an increased likelihood of accumulation of foulant deposits. Optionally, other vapor distribution devices can be included along with the pump-around section.

Abstract: Methods and apparatus are disclosed for implementing capacitors in semiconductor devices. An example semiconductor die includes a first dielectric material disposed between a first metal interconnect and a second metal interconnect; and a capacitor positioned within a via extending through the first dielectric material between the first and second metal interconnects, the capacitor including a second dielectric material disposed in the via between the first and second metal interconnects.

Abstract: A method comprises: installing the target software version on a first node of the storage appliance; restarting the first node of the storage appliance while also running the current software version on other nodes of the storage system; subsequent to said installing the target software version and said restarting of the first node, determining if all hosts of the storage system have discovered paths to volumes on the first node; responsive to determining that all hosts of the storage system have discovered paths to volumes on the first node, permitting the CCU of the nodes to continue to upgrade one of the other nodes of the storage system from the current software version to the target software version; and responsive to determining that not all hosts of the storage system have discovered paths to volumes on the first node, preventing the CCU of the nodes from continuing.

Abstract: Provided are a method, system, and computer program product in which a storage volume is configured to be maintained in a replicated relationship between two storage systems. A reversing is performed of a switch of a direction of replication for a replicated storage volume, in response to determining that host activity does not sufficiently match a pre-switch host activity, where the host activity does not sufficiently match the pre-switch host activity if a predetermined set of criteria is not met.

Abstract: A spinal adjustment system including at least one thermally actuated pump element.

Abstract: A method comprises: installing the target software version on a first node of the storage appliance; restarting the first node of the storage appliance while also running the current software version on other nodes of the storage system; subsequent to said installing the target software version and said restarting of the first node, determining if all hosts of the storage system have discovered paths to volumes on the first node; responsive to determining that all hosts of the storage system have discovered paths to volumes on the first node, permitting the CCU of the nodes to continue to upgrade one of the other nodes of the storage system from the current software version to the target software version; and responsive to determining that not all hosts of the storage system have discovered paths to volumes on the first node, preventing the CCU of the nodes from continuing.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which creates structural strength in the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which increases in thickness and provides structural strength to the packaging material when expanded.

Abstract: Provided are computing systems, methods, and platforms that automatically produce production-ready machine learning models and deployment pipelines from minimal input information such as a raw training dataset. In particular, one example computing system can import a training dataset associated with a user. The computing system can execute an origination machine learning pipeline to perform a model architecture search that selects and trains a machine learning model for the training dataset. Execution of the origination machine learning pipeline can also result in generation of a deployment machine learning pipeline configured to enable deployment of the machine learning model (e.g., running the machine learning model to produce inferences and/or optionally other tasks such as re-training and/or re-tuning the model).

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclosure formed with the packaging material. The packaging material includes at least a first layer and a second layer bonded to one another. The first layer is pulled or extended in a first direction that is effective to cause the second layer to expand in a second direction. The second layer is a cut-patterned layer which creates structural strength in the packaging material when expanded.