Abstract: A low cost method for attaching a heat slug to a printed circuit board using surface-mount technology. In one embodiment a metal coating is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.

Abstract: An apparatus for removing heat from an integrated circuit package. In one embodiment, the present invention includes a heat slug that is capable of being installed within an opening in a printed circuit board using a standard pick-and-place machine. The surface mountable heat slug includes a top portion and a bottom portion, wherein the bottom portion is formed to fit within the printed circuit board opening. The top portion of the heat slug is attached to the top surface of the printed circuit board. The integrated circuit package is attached to the bottom portion of the heat slug which is exposed along the bottom surface of the printed circuit board.