Abstract: A metrology system is provided for use with a movement system that moves an end tool (e.g., a probe). The metrology system includes a sensor configuration, a light beam source configuration and a processing portion. The sensor configuration comprises a plurality of light beam sensors. The light beam source configuration directs light beams to the light beam sensors of the sensor configuration. One of the light beam source configuration or the sensor configuration is coupled to the end tool and/or an end tool mounting configuration of the movement system which moves the end tool. The light beams that are directed to the light beam sensors cause the light beam sensors to produce corresponding measurement signals. A processing portion processes the measurement signals from the light beam sensors which indicate the position and orientation of the end tool.

Abstract: A system for measuring a hole includes a hole measuring device, processor(s) and a memory. The hole measuring device includes an end portion and an imaging portion. The end portion is configured to be inserted in a hole and includes at least first and second outer contact surface portions configured to be biased against the inner surface of the hole such that a contact distance between the first and second outer contact surface portions varies depending on the diameter of the hole. The end portion includes one or more reference surface portions (e.g., which are each configured to move when a corresponding outer contact surface portion moves). The imaging portion acquires an image of the one or more reference surface portions. The acquired image is used to determine relative positions of the one or more reference surface portions, which in turn are used to determine the diameter of the hole.

Abstract: A machine vision inspection system and method perform operations including: acquire a first image at a first image position, wherein the first image includes a first feature of a workpiece and a first measurement marking set of a measurement marking device (MMD); determine a first relative position of the first feature in the first image; move a stage supporting the workpiece to acquire a second image at a second image position, wherein the second image includes a second feature of the workpiece and a second measurement marking set of the MMD; determine a second relative position of the second feature in the second image; and determine a distance between the first feature and the second feature based at least in part on the first relative position, the second relative position and a distance between a measurement marking of the first set and a measurement marking of the second set.

Abstract: A micrometer head displacement system includes a micrometer head and an imaging portion. The micrometer head includes a coarse scale and a fine scale. The system is configured to: acquire at least one image of the micrometer head from the imaging portion; determine a coarse measurement based at least in part on the at least one image wherein the coarse measurement corresponds to a coarse relative position between the coarse scale and a coarse fiducial line; determine a fine measurement based at least in part on the at least one image and based on calculating an interpolated position of the a fiducial line wherein the fine measurement corresponds to a fine relative position between the fine scale and the fine fiducial line; and determine a micrometer head displacement based at least in part on summing the coarse measurement with the fine measurement.

Abstract: A supplementary metrology position coordinates determination (SMPD) system is used with a robot. “Robot accuracy” (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of its movable arm configuration) is based on robot position sensors included in the robot. The SMPD system includes an imaging configuration and an XY scale and an alignment sensor for sensing alignment/misalignment therebetween, and an image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the movable arm configuration and the other is coupled to a stationary element (e.g., a frame above the robot). The imaging configuration acquires an image of the XY scale with known alignment/misalignment, which is utilized to determine metrology position coordinates that are indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A metrology system is provided for use with a movement system that moves an end tool (e.g., a probe). The metrology system includes a sensor configuration, a light beam source configuration and a processing portion. The sensor configuration comprises a plurality of light beam sensors. The light beam source configuration directs light beams to the light beam sensors of the sensor configuration. One of the light beam source configuration or the sensor configuration is coupled to the end tool and/or an end tool mounting configuration of the movement system which moves the end tool. The light beams that are directed to the light beam sensors cause the light beam sensors to produce corresponding measurement signals. A processing portion processes the measurement signals from the light beam sensors which indicate the position and orientation of the end tool.

Abstract: A supplementary metrology position coordinates determination (SMPD) system is used with a robot. “Robot accuracy” (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of its movable arm configuration) is based on robot position sensors included in the robot. The SMPD system includes an imaging configuration and an XY scale and an alignment sensor for sensing alignment/misalignment therebetween, and an image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the movable arm configuration and the other is coupled to a stationary element (e.g., a frame above the robot). The imaging configuration acquires an image of the XY scale with known alignment/misalignment, which is utilized to determine metrology position coordinates that are indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A supplementary metrology position determination system is provided for use with a robot. The robot includes a movable arm configuration and a motion control system configured to control an end tool position with a robot accuracy (i.e., based on sensors included in the robot). The supplementary system includes cameras and 2D scales, each of which is attached to the movable arm configuration (e.g., as attached on arm portions and/or rotary joints). The cameras are operated to acquire images for determining relative positions of the scales. The scales may be coupled to rotary joints (e.g., as may be utilized to determine rotary motion as well as any motion transverse to a rotary axis), and/or to arm portions (e.g., as may be utilized to determine any bending or twisting of the arm portions). Such information may be utilized to achieve higher accuracy (e.g., for measurement operations and/or control of the robot, etc.).

Abstract: An end tool metrology position coordinates determination system is provided for use with a robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of a movable arm configuration of the robot) is based on using position sensors (e.g., encoders) included in the robot. The system includes the end tool, an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the end tool and the other is coupled to a stationary element (e.g., a frame located above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine a relative position that is indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A supplementary metrology position determination system is provided for use with a robot. The robot includes a movable arm configuration and a motion control system configured to control an end tool position with a robot accuracy (i.e., based on sensors included in the robot). The supplementary system includes cameras and 2D scales, each of which is attached to the movable arm configuration (e.g., as attached on arm portions and/or rotary joints). The cameras are operated to acquire images for determining relative positions of the scales. The scales may be coupled to rotary joints (e.g., as may be utilized to determine rotary motion as well as any motion transverse to a rotary axis), and/or to arm portions (e.g., as may be utilized to determine any bending or twisting of the arm portions). Such information may be utilized to achieve higher accuracy (e.g., for measurement operations and/or control of the robot, etc.).

Abstract: A supplementary metrology position coordinates determination system is provided for use with a robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of a movable arm configuration of the robot) is based on using position sensors (e.g., encoders) included in the robot. The supplementary metrology position coordinates determination system includes an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the movable arm configuration and the other is coupled to a stationary element (e.g., a frame above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine metrology position coordinates that are indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A supplementary metrology position coordinates determination system is provided for use with an articulated robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is coupled to a robot arm portion that moves in an XY plane), is based on using position sensors (e.g., rotary encoders) included in the robot. The supplementary system includes an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the robot arm portion and the other is coupled to a stationary element (e.g., a frame located above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine a relative position that is indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: An end tool metrology position coordinates determination system is provided for use with a robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of a movable arm configuration of the robot) is based on using position sensors (e.g., encoders) included in the robot. The system includes the end tool, an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the end tool and the other is coupled to a stationary element (e.g., a frame located above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine a relative position that is indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A combined workpiece holder and calibration profile configuration (CWHACPC) is provided for integration into a surface profile measurement system. The CWHACPC may comprise at least a first calibration profile portion and a workpiece holding portion that holds a workpiece in a stable position during measurement. The first calibration profile portion comprises a plurality of reference surface regions that have known reference surface z heights or z height differences relative to one another. The first calibration profile portion and the workpiece holding portion are configured to fit within a profile scan path range of the surface profile measurement system, such that the surface profile measurement system can acquire measured surface profile data for the first calibration profile portion and the workpiece during a single pass along the profile scan path. The acquired surface profile data for the reference surface regions may be used to indicate and/or correct certain errors.

Abstract: A supplementary metrology position coordinates determination system is provided for use with a robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is mounted proximate to a distal end of a movable arm configuration of the robot) is based on using position sensors (e.g., encoders) included in the robot. The supplementary metrology position coordinates determination system includes an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the movable arm configuration and the other is coupled to a stationary element (e.g., a frame above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine metrology position coordinates that are indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A supplementary metrology position coordinates determination system is provided for use with an articulated robot. A first accuracy level defined as a robot accuracy (e.g., for controlling and sensing an end tool position of an end tool that is coupled to a robot arm portion that moves in an XY plane), is based on using position sensors (e.g., rotary encoders) included in the robot. The supplementary system includes an imaging configuration, XY scale, image triggering portion and processing portion. One of the XY scale or imaging configuration is coupled to the robot arm portion and the other is coupled to a stationary element (e.g., a frame located above the robot). The imaging configuration acquires an image of the XY scale, which is utilized to determine a relative position that is indicative of the end tool position, with an accuracy level that is better than the robot accuracy.

Abstract: A first position measurement device (“FPMD”) is configured to control and operate both standalone and combined device operating modes. During the combined device operating mode, the FPMD inputs second-device measurement sample outputs provided by a second position measurement device (“SPMD”) via an inter-device communication connection. The FPMD and the SPMD are held in a fixed relationship in a workpiece measurement arrangement (e.g., with transverse measuring axes). Concurrent measurement data sets are determined as including at least a first-device measurement sample output from the FPMD and a second-device measurement sample output from the SPMD corresponding to concurrent first-device and second-device sample periods. Each concurrent measurement data set is associated with a corresponding measurement sample region on the workpiece. A combined measurement data output (e.g.

Abstract: A combined workpiece holder and calibration profile configuration (CWHACPC) is provided for integration into a surface profile measurement system. The CWHACPC may comprise at least a first calibration profile portion and a workpiece holding portion that holds a workpiece in a stable position during measurement. The first calibration profile portion comprises a plurality of reference surface regions that have known reference surface z heights or z height differences relative to one another. The first calibration profile portion and the workpiece holding portion are configured to fit within a profile scan path range of the surface profile measurement system, such that the surface profile measurement system can acquire measured surface profile data for the first calibration profile portion and the workpiece during a single pass along the profile scan path. The acquired surface profile data for the reference surface regions may be used to indicate and/or correct certain errors.

Abstract: A first position measurement device (“FPMD”) is configured to control and operate both standalone and combined device operating modes. During the combined device operating mode, the FPMD inputs second-device measurement sample outputs provided by a second position measurement device (“SPMD”) via an inter-device communication connection. The FPMD and the SPMD are held in a fixed relationship in a workpiece measurement arrangement (e.g., with transverse measuring axes). Concurrent measurement data sets are determined as including at least a first-device measurement sample output from the FPMD and a second-device measurement sample output from the SPMD corresponding to concurrent first-device and second-device sample periods. Each concurrent measurement data set is associated with a corresponding measurement sample region on the workpiece. A combined measurement data output (e.g.

Abstract: A focus state reference subsystem comprising a focus state (FS) reference object is provided for use in a variable focal length (VFL) lens system comprising a VFL lens, a controller that modulates its optical power, and a camera located along an optical path including an objective lens and the VFL lens. Reference object image light from the FS reference object is transmitted along a portion of the optical path through the VFL lens to the camera. Respective FS reference regions (FSRRs) of the FS reference object include a contrast pattern fixed at respective focus positions. A camera image that includes a best-focus image of a particular FSRR defines a best-focus reference state associated with that FSRR, wherein that best-focus reference state comprises a VFL optical power and/or effective focus position of the VFL lens system through the objective lens.