Abstract: Techniques and mechanisms for a memory device to support memory repair functionality for a column of a memory array. In an embodiment, the column comprises first memory cells and second memory cells, where switch circuitry is coupled between multiple signal lines and the column. Control circuitry transitions the switch circuitry to a state which corresponds to a defective one of the first cells. The state switchedly decouples the defective cell, and an adjoining one of the first cells, each from respective ones of the signal lines. During the state, two or more of the signal lines are able to communicate each to a different respective one of the second cells. In another embodiment, the switch circuitry is transitioned to the state based on an identifier of the defective cell, and independent of whether any other cell of the column has been identified as defective.

Abstract: Disclosed is a motion simulating device that includes a first scissor jack having a helical screw and a motor that rotates the helical screw of the scissor jack thereby raising or lowering the first scissor jack. Also included is a second scissor jack also having a helical screw and a motor that rotates the helical screw thereby raising or lowering the second scissor jack. At least one platform can be connected to the first and second scissor jacks. A controller is in communication with the first and second motors so that rotation of the helical screws of the first and second scissor jacks raises or lowers the scissor jacks thereby moving the platform up and down in accordance with movement of the scissor jacks. The controller can be a joystick, a steering wheel, foot pedals, a voice trigger, a gear shifter, roller ball, or any other device capable of translating mechanical energy into an electrical signal. The motion simulating device can also include at least one additional controller.

Abstract: Disclosed is a hybrid built-in self test (BIST) architecture for embedded memory arrays that segments BIST functionality into remote lower-speed executable instructions and local higher-speed executable instructions. A standalone BIST logic controller operates at a lower frequency and communicates with a plurality of embedded memory arrays using a BIST instruction set. A block of higher-speed test logic is incorporated into each embedded memory array under test and locally processes BIST instructions received from the standalone BIST logic controller at a higher frequency. The higher-speed test logic includes a multiplier for increasing the frequency of the BIST instructions from the lower frequency to the higher frequency. The standalone BIST logic controller enables a plurality of higher-speed test logic structures in a plurality of embedded memory arrays.

Abstract: A bit fail map circuit accurately generates a bit fail map of an embedded memory such as a DRAM by utilizing a high speed multiplied clock generated from a low-speed Automated Test Equipment (ATE) tester. The circuit communicates between the ATE tester, the embedded memory under test, Built-In Self-Test (BIST) and Built-In Redundancy Analysis (BIRA). An accurate bit fail map of an embedded DRAM memory is provided by pausing the BIST test circuitry at a point when a fail is encountered, namely a mismatch between BIST expected data and the actual data read from the array, and then shifting the bit fail data off the chip using the low-speed ATE tester clock. Thereafter, the high-speed test is resumed from point of fail by again running the BIST using the high-speed internal clock, to provide at-speed bit Fail Maps.