Patents by Inventor Michael Niedermayer

Michael Niedermayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10902305
    Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: January 26, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
  • Patent number: 10582642
    Abstract: Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: March 3, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Patent number: 10426025
    Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: September 24, 2019
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Mueller, Michael Niedermayer, Ulrich Wittreich
  • Publication number: 20190286958
    Abstract: Various embodiments may include an identification device comprising: a data memory storing a piece of information containing an identification; a processor generating a signal indicating the piece of information; an optical-to-electrical energy converter supplying power for the processor and converting electromagnetic radiation from the surroundings into an electric current feeding the processor via a power connection; an output device with a data connection to the processor for transmitting the signal; and an executable program stored in the processor for reading an input signal transmitted via the power connection and superimposed on the electrical current.
    Type: Application
    Filed: May 12, 2017
    Publication date: September 19, 2019
    Applicant: Siemens Aktiengesellschaft
    Inventors: Rüdiger Knofe, Stefan Nerreter, Michael Niedermayer
  • Publication number: 20180269371
    Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 20, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin Franke, Peter Frühauf, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Michael Niedermayer, Ulrich Wittreich, Manfred Zäske
  • Publication number: 20180235101
    Abstract: The present disclosure relates to electronics. The teachings thereof may be embodied in cooling members for electronic components and/or methods for producing cooling members with an assembly side for an electronic component. For example, a cooling member may include: an assembly side for mounting an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels with a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
    Type: Application
    Filed: July 8, 2016
    Publication date: August 16, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin FRANKE, Peter FRÜHAUF, Rüdiger KNOFE, Bernd MÜLLER, Stefan NERRETER, Michael NIEDERMAYER, Ulrich WITTREICH, Manfred ZÄSKE
  • Publication number: 20180049315
    Abstract: The present disclosure relates manufacturing for electronic circuit in a production installation. The teachings thereof may be embodied in a method for manufacturing an electronic circuit in a production installation comprising: detachably connecting a circuit carrier to a measuring module before performance of a process step; performing a measurement with the measuring module during the performance of the process step; and removing the measuring module from the circuit carrier after termination of the process step.
    Type: Application
    Filed: February 11, 2016
    Publication date: February 15, 2018
    Applicant: Siemens Aktiengesellschaft
    Inventors: Bernd Mueller, Michael Niedermayer, Ulich Wittreich
  • Publication number: 20130274567
    Abstract: The invention relates to a sensor system for implantation into a body of a living being, comprising a measuring unit for measuring parameters of the body and generating corresponding measurement signals, a transmitting unit for transmitting signals using the measurement signals, a control and analysis unit which is connected to the measuring unit and the transmitting unit in order to process and prepare the measurement signals and control the transmitting unit for transmitting the transmitting signals, an energy storing unit for supplying energy to the units, and an outer casing that at least partly surrounds the measuring unit, the transmitting unit, the analysis unit, and the energy storing unit.
    Type: Application
    Filed: October 14, 2011
    Publication date: October 17, 2013
    Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Volker Grosser, Stephan Guttowski, Michael Niedermayer