Abstract: A heat pipe comprises a first substrate and an evaporator portion comprising a plurality of raised features on a surface of the first substrate. The heat pipe also comprises a condenser portion including a coating of an organic compound on the surface of the first substrate, wherein the coating of the organic compound on the surface of the first substrate in the condenser portion has a carbon content in a range of 1% to 15%. The heat pipe further comprises a second substrate bonded to the first substrate and a working fluid between the first substrate and the second substrate.

Abstract: The disclosure can include a system and device for heat dissipation associated with a mixed reality device which includes a tubular member comprising a proximal end and a distal end. The tubular member comprises a shell and defines a vapor cavity and the tubular member is sealed at the proximal and distal ends. The heat dissipation device includes an outer heating engine oriented in the vapor cavity. The outer heating engine is adjacent to an inner surface wall of the tubular member. The heat dissipation device includes an inner heating engine oriented inside of the outer heating engine, wherein an outer surface of the inner heating engine defines a supplemental cavity bounded by an inner wall of the tubular member and the outer surface of the inner heating engine.

Abstract: A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

Abstract: A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one or more antennas disposed thereon.

Abstract: A thermal system configured to bend in multiple directions and provide a thermal conduit to transfer heat through an electronic device having a bent or curved profile. A thermal system may include a first thermal management component, a second thermal management component, and a memory material coupler coupled to the first thermal management component and the second thermal management component. The memory material coupler is configured to provide mechanical articulation of the first thermal management component relative to the second thermal management component and transfer heat from a first location to a second location of the electronic device.

Abstract: A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.

Abstract: A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).

Abstract: An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

Abstract: A method for constructing heat transfer architectures for use in wearables or other small electronic devices using selective micro plating to quickly and precisely generate complex 3D microstructures, a heat transfer architecture, and electronic device with a heat transfer architecture includes creating capillary wick structures, wherein the capillary wick structures may vary in characteristics. An interface may be generated with a vessel wall to provide an optimal interface between the capillary wick structures and the vessel wall.

Abstract: An elongated heat pipe or vapor chamber is described. In examples, the heat pipe may include a tubular body comprising a hollow glass tube or fiber. The heat pipe may further include a wick within the tubular body and a working fluid within the tubular body. The wick may be made of glass, polymer, metal, etc. The wick may be an elongated cylinder disposed within the tubular body and, some cases, may be bonded to an inner floor of the tubular body. In examples, the wick may have an outer diameter substantially equal to an inner diameter of the tubular body. In examples, the wick may have a substantially cross-shaped cross section or may have a helical shape.

Abstract: A wearable device includes a housing having a cavity and a thermal interposer disposed within the cavity of the housing and thermally coupled to the housing to draw thermal energy from one or more electrical components of the wearable device and to transfer the thermal energy to the housing.

Abstract: An elongated heat pipe is described. In examples, the heat pipe may include a body comprising a polygonal-shaped cross-section and a RF compatible material, e.g., a ceramic, a polymer, glass, etc. The heat pipe may further include a working fluid disposed within the body.

Abstract: A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.

Abstract: An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.

Abstract: A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.

Abstract: An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

Abstract: A heat pipe comprises a first substrate and an evaporator portion comprising a plurality of raised features on a surface of the first substrate. The heat pipe also comprises a condenser portion including a coating of an organic compound on the surface of the first substrate, wherein the coating of the organic compound on the surface of the first substrate in the condenser portion has a carbon content in a range of 1% to 15%. The heat pipe further comprises a second substrate bonded to the first substrate and a working fluid between the first substrate and the second substrate.

Abstract: A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.

Abstract: A polymer laminate includes a plurality of ultra-high molecular weight polyethylene thin films, where each polyethylene thin film has an in-plane thermal conductivity of at least approximately 5 W/mK and an in-plane elastic modulus of at least approximately 20 GPa. The polymer laminate may be incorporated into an eyewear device and may be configured to disperse heat during operation thereof in a manner effective to improve the functionality and/or wearability of the device.

Abstract: Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.