Abstract: A sensor, such as an electrostatic particle sensor, having a housing in which a sensor element is disposed, and a gas-tight electrical feedthrough through the housing, the feedthrough being configured for directing electrical currents and/or voltages from electrical components that are disposed outside the housing into the housing and/or out of the housing. In order for a sensor which permanently has at least one gas-tight electrical feedthrough through the housing thereof to be provided, the electrical feedthrough has a ceramic molded body which has at least one through bore, the latter having a first end and a second end, wherein the through bore from the first end up to the second end is filled with a metallic paste, and the ceramic molded body in a sintering process is connected to the metallic paste, and in the region of the first end and/or of the second end of the through bore at least one metallic tube piece is attached to the sintered metallic paste.

Abstract: With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.

Abstract: In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of the leadframe. In this case, the leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.