Patents by Inventor Michael Nosonovsky

Michael Nosonovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150336360
    Abstract: Embodiments of a superhydrophobic structure comprise a substrate and a hierarchical surface structure disposed on at least one surface of the substrate, wherein the hierarchical surface structure comprises a microstructure comprising a plurality of microasperities disposed in a spaced geometric pattern on at least one surface of the substrate. The fraction of the surface area of the substrate covered by the microasperities is from between about 0.1 to about 1. The hierarchical structure comprises a nanostructure comprising a plurality of nanoasperities disposed on at least one surface of the microstructure.
    Type: Application
    Filed: March 30, 2015
    Publication date: November 26, 2015
    Inventors: Bharat Bhushan, Yong Chae Jung, Michael Nosonovsky
  • Patent number: 8137751
    Abstract: Embodiments of methods of making superhydrophobic structures comprise depositing a polymer mold onto a silicon surface comprising a plurality of microasperities, removing the polymer mold after the polymer mold has hardened, depositing a liquid epoxy resin into the polymer mold, forming a microstructure with a plurality of microasperities by separating the epoxy resin from the mold after the epoxy resin has solidified, and forming a superhydrophobic structure by depositing a plurality of alkane nanoasperities on the microstructure in the presence of solvent vapor.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: March 20, 2012
    Assignee: The Ohio State University
    Inventors: Bharat Bhushan, Yong Chae Jung, Michael Nosonovsky
  • Publication number: 20110177288
    Abstract: Embodiments of methods of making superhydrophobic structures comprise depositing a polymer mold onto a silicon surface comprising a plurality of microasperities, removing the polymer mold after the polymer mold has hardened, depositing a liquid epoxy resin into the polymer mold, forming a microstructure with a plurality of microasperities by separating the epoxy resin from the mold after the epoxy resin has solidified, and forming a superhydrophobic structure by depositing a plurality of alkane nanoasperities on the microstructure in the presence of solvent vapor.
    Type: Application
    Filed: April 1, 2011
    Publication date: July 21, 2011
    Inventors: Bharat Bhushan, Yong Chae Jung, Michael Nosonovsky
  • Publication number: 20100028604
    Abstract: Embodiments of a superhydrophobic structure comprise a substrate and a hierarchical surface structure disposed on at least one surface of the substrate, wherein the hierarchical surface structure comprises a microstructure comprising a plurality of microasperities disposed in a spaced geometric pattern on at least one surface of the substrate. The fraction of the surface area of the substrate covered by the microasperities is from between about 0.1 to about 1. The hierarchical structure comprises a nanostructure comprising a plurality of nanoasperities disposed on at least one surface of the microstructure.
    Type: Application
    Filed: September 22, 2008
    Publication date: February 4, 2010
    Applicant: THE OHIO STATE UNIVERSITY
    Inventors: Bharat Bhushan, Yong Chae Jung, Michael Nosonovsky
  • Publication number: 20060078724
    Abstract: A hydrophobic surface comprising a substrate and a roughened surface structure oriented on the substrate material is provided. The substrate comprises a surface, which is at least partially hydrophobic with a contact angle to liquid of 90° or greater. The roughened surface structure comprises a plurality of asperities arranged in a geometric pattern according to a roughness factor, wherein the roughness factor is characterized by a packing parameter p that equals the fraction of the surface area of the substrate covered by the asperities. The p parameter has a value from between about 0.5 to about 1.
    Type: Application
    Filed: March 31, 2005
    Publication date: April 13, 2006
    Inventors: Bharat Bhushan, Michael Nosonovsky