Abstract: A vaporizer body (1) having a vaporizing surface (3) for vaporizing metal in a PVD-metallization installation, wherein the vaporizing surface (3) comprises a plurality of recesses (5, 5?, 5?), with an opening of the respective recess having an area/perimeter-ratio of greater than or equal to 1.5 mm.

Abstract: The invention relates to the use of pigments coated in an acid-resistant manner in PVC synthetic material. Acid-soluble pigments are provided with a coating of an organic compound that melts at a temperature of T>200° C., and as a result the otherwise acid-soluble pigments are still protected from HCl vapor even at PVC processing temperatures of between 180° C. and 200° C.

Abstract: The invention describes the use of a zinc oxide containing frit with a ZnO content of 20 wt % to 75 wt % and an average grain size of less than 30 ?m as a UV light absorbing UV protection means, for example for the application areas of thermoplastically deformable synthetic materials, solvent-containing and water-containing lacquers/varnishes, radiation-curing lacquers/varnishes, powder lacquers/varnishes, paper coatings and hydraulic-setting construction products.

Abstract: A vaporizer body (1) having a vaporizing surface (3) for vaporizing metal in a PVD-metallization installation, wherein the vaporizing surface (3) comprises a plurality of recesses (5, 5?, 5?), with an opening of the respective recess having an area/perimeter-ratio of greater than or equal to 1.5 mm.

Abstract: An initial wetting auxiliary material is for applying to a vaporiser surface of an electrically heatable ceramic vaporiser body. The vaporiser body is used for operation in a physical vapour deposition (PVD) metallisation installation for vaporising aluminium. The vaporiser body contains nitrogen as a material component. The auxiliary material comprises a powder mixture which comprises (a) aluminium in powder form having a particle size which is at most 0.6 mm. The aluminium in powder form melts on the vaporiser surface after initiating the operation of the vaporiser body and reacted with the nitrogen of the vaporiser body to form an aluminium nitride layer on the vaporiser surface. The powder mixture further comprises (b) a wetting agent in powder form promoting an even and large-surface distribution of the molten aluminium on the vaporiser surface.

Abstract: Preparing and operating a vaporizer body in a PVD-metallization system for continuously supplying and vaporizing metal. A layer structure deposited onto the vaporizer body comprising sinterable powder material in a substantially unsintered state, to which the metal is supplied, is deposited as a raw layer structure onto the vaporizer body and sintered onto the same in the metallization cycle by heating the vaporizer body. The layer structure is consumable during the metallization process and can be replaced directly in the metallization system after each metallization cycle.

Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

Abstract: Process for removing deposits from water-carrying systems and devices for water supply, or from their individual parts, in which the deposits are dissolved by means of an aqueous treatment solution and removed in dissolved form from the system or the device or their individual parts, wherein the deposits are dissolved by means of an aqueous treatment solution comprised of a combination of (i) a reducing agent, in particular in the form of a slat-like, reducing sulfur-oxygen compound, nitrogen-oxygen compound or phosphorous-oxygen compound, and (ii) a complexing agent having phosphonic acid groups or phosphonate groups or a complexing agent of the hydroxy acid type at pH values in the range of approximately 4.5 to 9.5, in particular from approximately 6.0 to 8.0.

Abstract: Process for removing deposits from water-carrying systems and devices for water supply, or from their individual parts, in which the deposits are dissolved by means of an aqueous treatment solution and removed in dissolved form from the system or the device or their individual parts, wherein the deposits are dissolved by means of an aqueous treatment solution comprised of a combination of (i) a reducing agent, in particular in the form of a slat-like, reducing sulfur-oxygen compound, nitrogen-oxygen compound or phosphorous-oxygen compound, and (ii) a complexing agent having phosphonic acid groups or phosphonate groups or a complexing agent of the hydroxy acid type at pH values in the range of approximately 4.5 to 9.5, in particular from approximately 6.0 to 8.0.