Abstract: The invention is a vacuum bag sealing system for the manufacturing of composite structures and the like in a mold. In detail, the system comprises a base plate for mounting the mold. A first Teflon coated sealing surface is bonded to the base plate extending about the periphery of the mold. Also included is a vacuum bag, having a second Teflon coated sealing surface bonded thereto in a complimentary relationship to the first sealing surface when the vacuum bag is placed over the mold and base plate. A bead of conventional vacuum bag sealant is used to bond the first sealing surface to the second sealing surface so that an airtight seal is formed between the vacuum bag and the base plate.