Patents by Inventor Michael Obesser

Michael Obesser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Weldable contact and method for the production thereof
    Patent number: 8456022
    Abstract: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: June 4, 2013
    Assignee: Epcos AG
    Inventors: Robert Hammedinger, Konrad Kastner, Martin Maier, Michael Obesser
  • Component with Mechanically Loadable Connecting Surface
    Publication number: 20100116531
    Abstract: A component having a multilayer solderable or bondable connecting surface on a substrate is proposed, which, in addition to the electrically conductive pad metallization and the UBM metallization also has an electrically conductive stress compensation layer that is arranged between the substrate and the pad metallization or between the pad metallization and the UBM metallization. The insensitivity to stress of the connecting metallization is achieved by means of a stress compensation layer whose modulus of elasticity is less than that of the UBM metallization.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 13, 2010
    Inventors: Martin Maier, Michael Obesser, Konrad Kastner, Juergen Portmann, Ulrich Bauernschmitt
  • WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20090020325
    Abstract: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
    Type: Application
    Filed: February 9, 2006
    Publication date: January 22, 2009
    Inventors: Robert Hammedinger, Konrad Kastner, Martin Maier, Michael Obesser