Patents by Inventor Michael Ohlinger

Michael Ohlinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board/chassis grounding apparatus and methods
    Patent number: 5420378
    Abstract: To facilitate a grounding connection between a circuit board and a chassis upon which it is to be mounted, a spaced series of unlined mounting holes are formed through the substrate portion of the circuit board between its top and bottom sides, and spaced series of grounding vias are formed through the substrate and positioned in a circular arrays around each of the mounting holes. Annular layers of a metallic plating material are formed on the opposite sides of the circuit board substrate, around the top and bottom ends of the unlined mounting holes, with the plating material being extended along the interior side surfaces of the vias between associated top and bottom annular plating material layers.
    Type: Grant
    Filed: July 14, 1994
    Date of Patent: May 30, 1995
    Assignee: Dell USA, L.P.
    Inventors: H. Scott Estes, Michael Ohlinger, N. Deepak Swamy