Patents by Inventor Michael Opiz Real

Michael Opiz Real has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flange for semiconductor die
    Patent number: 8604609
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
  • Flange for semiconductor die
    Patent number: 8314487
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 20, 2012
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
  • Flange for Semiconductor Die
    Publication number: 20110147921
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real