Abstract: A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed.

Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.

Abstract: An electrical socket connection for coupling a conductive pin to a circuit board. The socket has several contact points that can be expanded to create an opening sufficiently sized to allow the conductive pin to pass through the contact points with minimal insertion force. After the pin is inserted, the contact points can be retracted to form electrical interconnects with the pin. The contacts are electrically coupled to the remaining circuitry via the socket. The present invention, therefore, provides a zero insertion force socket that has multiple contact points and does not require secondary movement of the pin or circuit package.

Abstract: An electrical socket connection for coupling a conductive pin to a circuit board. The socket has several contact points that can be expanded to create an opening sufficiently sized to allow the conductive pin to pass through the contact points with minimal insertion force. After the pin is inserted, the contact points can be retracted to form electrical interconnects with the pin. The contacts are electrically coupled to the remaining circuitry via the socket. The present invention, therefore, provides a zero insertion force socket that has multiple contact points and does not require secondary movement of the pin or circuit package.

Abstract: A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.

Abstract: The invention in one embodiment is a zero insertion force socket including a base; a cover engaged with the base to reciprocate in first and second directions; and a lever pivotably mounted to the base to move the cover in the first direction when the lever is pivoted laterally from a first position to a second position. In another embodiment, the invention is a printed circuit board assembly including a printed circuit board; a zero insertion force socket surface mounted to the printed circuit board; and a processor coupled to the zero insertion force socket.

Abstract: A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

Abstract: The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.

Abstract: A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

Abstract: A method and apparatus for making the weight load distribution more uniform over the surface of a processor die and improving the heat transfer between the processor die and a thermal spreader cap is provided. The apparatus includes generally a square-like box shaped thermal spreader cap having a cavity that conforms to the shape of the processor die. The thermal spreader cap fits over the processor die and has a cavity that is dome-like in shape. Additionally, the thermal spreader cap is attached to a thermal dissipative device which may in turn be connected to a heat sink. The apparatus provides a thinner and more uniform thermal interface layer between the processor die and the thermal spreader cap, thereby evening the weight load on the surface of the processor die and improving the heat flux between the processor die and the thermal spreader cap.

Abstract: An electronic assembly that contains a pair of C-shaped springs that couple an integrated circuit and a lid to a printed circuit board. The assembly includes a first spring that is mounted to the printed circuit board. The first spring has a C-shaped finger. The integrated circuit is typically mounted to a substrate that is plugged into a socket which is mounted to the printed circuit board. A lid is stacked on top of the integrated circuit. The lid has a ball shaped outer rim. The assembly has a second spring which has a C-shaped finger that captures the outer rim of the lid, and a ball that is captured by the C-shaped finger of the first spring. The first and second springs are interlocked to secure the lid and integrated circuit to the printed circuit board. The lid and integrated circuit can be detached from the assembly by merely deflecting the second spring 36 and removing the components.