Abstract: An integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip. The sensor is in a conduit formed between a semiconductor substrate and a non-conductive cap with fluid entry and exit points through the cap. The conduit may be entirely in the cap, in the substrate or in both. The conduit includes encased temperature sensors at both ends and a central encased heater. The temperature sensors may each include multiple encased diodes and the heater may include multiple encased resistors.

Abstract: An integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip. The sensor is in a conduit formed between a semiconductor substrate and a non-conductive cap with fluid entry and exit points through the cap. The conduit may be entirely in the cap, in the substrate or in both. The conduit includes encased temperature sensors at both ends and a central encased heater. The temperature sensors may each include multiple encased diodes and the heater may include multiple encased resistors.

Abstract: An automated handling apparatus for testing and labeling a printed circuit board. The apparatus comprises a housing having at least one tray exchanger assembly attached thereto. Disposed on the tray exchanger assembly is a cassette tray which accommodates at least one circuit board, and is selectively movable between first and second positions by the tray exchanger assembly. Also attached to the housing is a testing assembly for conducting a desired testing protocol upon the circuit board, a labeler assembly for applying a label to the circuit board subsequent to the completion of the testing protocol, and a loader assembly for selectively transporting the circuit board between the tray exchanger, testing, and labeling assemblies.