Patents by Inventor Michael P. Ciaccio

Michael P. Ciaccio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10263300
    Abstract: A battery pack for supplying energy to propel a vehicle is disclosed. In one example, a battery pack includes a thermoplastic over mold for providing resistance to liquid is disclosed. The battery pack may have increased resistance to battery pack degradation.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: April 16, 2019
    Assignee: A123 Systems LLC
    Inventor: Michael P. Ciaccio
  • Publication number: 20140356651
    Abstract: A battery pack for supplying energy to propel a vehicle is disclosed. In one example, a battery pack includes a thermoplastic over mold for providing resistance to liquid is disclosed. The battery pack may have increased resistance to battery pack degradation.
    Type: Application
    Filed: February 7, 2013
    Publication date: December 4, 2014
    Inventor: Michael P. Ciaccio
  • Publication number: 20080047392
    Abstract: A torsional vibration damper hub assembly for a motor vehicle engine includes, in an exemplary embodiment, a hub formed from a filled thermoplastic material and having an outer wall. The thermoplastic material includes at least one filler. The assembly can also include a metal sleeve molded into the hub where the sleeve is overmolded with the filled thermoplastic material, an inertia ring positioned inside the hub, a rubber insert positioned between the inertia ring and the outer wall of the hub, and an end cap coupled to the hub enclosing the inertia ring the said rubber insert inside the hub.
    Type: Application
    Filed: August 24, 2006
    Publication date: February 28, 2008
    Inventor: Michael P. Ciaccio
  • Patent number: 5594199
    Abstract: An electronic control module includes an EMI baffle in the form of openings formed in laterally spaced portions of the cold plate supporting the electronic circuits. Preferably, upper and lower plates of the cold plate define a limited access baffle chamber with openings that require rerouted travel of any leakage radiation emanated by terminals or conductors carried by couplers inserted into the cold plate openings or passing through the openings. Preferably, each coupler is inserted through openings having an inlet axis in the cold plate and the module packaging covers are secured to the cold plate between an inlet and an outlet opening in the cold plate. Accordingly, simple gaskets may be used to seal the covers against the cold plates and the couplers against the cold plate. Moreover, the cold plate coolant passage has inlets and outlets that remain exposed exteriorly of the covers to avoid exposure of the internal circuitry to leakage.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: January 14, 1997
    Assignee: Ford Motor Company
    Inventor: Michael P. Ciaccio
  • Patent number: 5408049
    Abstract: An electrical system comprises an inverter, a three-phase electric motor and a cable to transfer energy from the inverter to the motor. The cable further comprises a center conductor and two additional conductors disposed about the center conductor. Insulators physically and electrically separate the conductors from one another. Electromagnetic emissions from the cable are substantially prevented due to the construction of the cable.
    Type: Grant
    Filed: November 1, 1993
    Date of Patent: April 18, 1995
    Assignee: Ford Motor Company
    Inventors: Allan R. Gale, Michael P. Ciaccio, Jerry E. Amey
  • Patent number: 5276587
    Abstract: An electrical device to be electrically mounted to a cooling mounting structure so that the electrical device is in intimate physical contact with the mounting structure for cooling the electrical device. The electrical device having a first pivot allowing contact for allowing the electrical device to be pivoted as it is mounted to the cooling mounting structure so that the electrical device is in intimate physical contact with the cooling mounting structure and for providing an electrical connection to the cooling mounting structure and the electrical device further having a second nonpivot allowing contact having a shape for providing electrical contact with the mounting structure when the electrical device is in intimate physical contact with the cooling mounting structure.
    Type: Grant
    Filed: April 8, 1993
    Date of Patent: January 4, 1994
    Assignee: Sundstrand Corporation
    Inventor: Michael P. Ciaccio
  • Patent number: 5177666
    Abstract: A cooling rack is provided for cooperating with a chassis, the chassis having both electrical and fluid connectors, the fluid connectors being interconnected by a manifold for distributing cooling fluid to and from the rack, the rack having a cooling support including at least one electrical component cooling pad, a rack manifold for circulating cooling fluid to the cooling pad, a rack electrical connector, a rack inlet fluid connector in fluid communication with the rack manifold for receiving cooling fluid from the chassis to be circulated through the rack manifold for cooling the cooling pad, and a rack outlet fluid connector in fluid communication with the rack manifold for returning cooling fluid from the rack manifold to the chassis so that the cooling fluid can be recooled, wherein the rack electrical connectors, the rack inlet fluid connector, and the rack outlet fluid connector are arranged so that, when the cooling rack is attached to the chassis, the rack electrical connector, the rack inlet fluid
    Type: Grant
    Filed: October 24, 1991
    Date of Patent: January 5, 1993
    Inventors: Timothy J. Bland, Michael P. Ciaccio, R. Scott Downing
  • Patent number: 5088005
    Abstract: A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed. A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling. The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled.
    Type: Grant
    Filed: May 8, 1990
    Date of Patent: February 11, 1992
    Assignee: Sundstrand Corporation
    Inventor: Michael P. Ciaccio
  • Patent number: 5038857
    Abstract: Leakage of fluid from a heat exchanger and fluid mixing in the case of a two fluid compact high intensity cooling heat exchanger are prevented by diffusion bonded areas of the heat exchanger formed using small locally raised borders which extend about the fluid passage or passages of the heat exchanger to form raised contact portions that experience locally high stresses during diffusion bonding thereby insuring material flow and complete bonding. The thickness of the locally raised borders is the same as or slightly greater than the tolerance of the rolled sheet material used to form the laminates of the heat exchanger whereby local deviations in thickness of the thin laminates will not result in non-bonded areas.
    Type: Grant
    Filed: June 19, 1990
    Date of Patent: August 13, 1991
    Assignee: Sundstrand Corporation
    Inventor: Michael P. Ciaccio