Patents by Inventor Michael P. Cuff

Michael P. Cuff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7187076
    Abstract: An area array connector for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element is described. The area array connector includes at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element. The area array connector also includes at least one thermally conductive member adapted to provide thermal interconnection between the first circuit element and the second circuit element.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: March 6, 2007
    Assignee: AirBorn, Inc.
    Inventors: Michael P. Cuff, John L. Grant
  • Patent number: 7021942
    Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: April 4, 2006
    Assignee: Airborn, Inc.
    Inventors: John L. Grant, Michael P. Cuff
  • Patent number: 6877992
    Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: April 12, 2005
    Assignee: Airborn, Inc.
    Inventors: John L. Grant, Michael P. Cuff
  • Publication number: 20040087189
    Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.
    Type: Application
    Filed: November 1, 2002
    Publication date: May 6, 2004
    Inventors: John L. Grant, Michael P. Cuff
  • Patent number: 6155887
    Abstract: Disclosed is a stackable contact system and a contact for use therein. The contact has a tuning fork socket and a cylindrical pin with a bowed compliant middle section for press fitting into a printed circuit board. Multiple contacts are mounted in two insulative housing parts having cavities, apertures and passages for holding the contacts in position. The contact systems may have a printed circuit board sandwiched between them, and multiple layer stacks may be formed.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: December 5, 2000
    Assignee: Airborn, Inc.
    Inventors: Michael P. Cuff, Claude G. Folta
  • Patent number: D560613
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: January 29, 2008
    Assignee: AirBorn, Inc.
    Inventors: Herbert J. McEvoy, Michael P. Cuff, John L. Grant
  • Patent number: D560614
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: January 29, 2008
    Assignee: AirBorn, Inc.
    Inventors: Herbert J. McEvoy, Michael P. Cuff, John L. Grant
  • Patent number: D561107
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: February 5, 2008
    Assignee: AirBorn, Inc.
    Inventors: Michael P. Cuff, John L. Grant
  • Patent number: D561108
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: February 5, 2008
    Assignee: AirBorn, Inc.
    Inventors: Michael P. Cuff, John L. Grant
  • Patent number: D561698
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: February 12, 2008
    Assignee: AirBorn, Inc.
    Inventors: Michael P. Cuff, John L. Grant
  • Patent number: D562775
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: February 26, 2008
    Assignee: AirBorn, Inc.
    Inventors: Michael P. Cuff, John L. Grant