Abstract: An isolated polypeptide comprising a peptide selected from: i) DHX1SDNYT, wherein X1 is L or H (SEQ ID NO:3); ii) a conservative variant of i) iii) a fragment of i) or ii); wherein the conservative variant and/or fragment retains biological activity and the peptide is 15 or less amino acids as well as recombinant cells, and uses thereof.

Abstract: An isolated polypeptide comprising a peptide selected from: i) DHX1SDNYT, wherein X1 is L or H (SEQ ID NO:3); ii) a conservative variant of i) iii) a fragment of i) or ii); wherein the conservative variant and/or fragment retains biological activity and the peptide is 15 or less amino acids as well as recombinant cells, and uses thereof.

Abstract: An isolated polypeptide comprising a peptide selected from: i) DHX1SDNYT, wherein X1 is L or H (SEQ ID NO:3); ii) a conservative variant of i) iii) a fragment of i) or ii); wherein the conservative variant and/or fragment retains biological activity and the peptide is 15 or less amino acids as well as recombinant cells, and uses thereof.

Abstract: An isolated polypeptide comprising a peptide selected from: i) DHX1SDNYT, wherein X1 is L or H (SEQ ID NO:3); ii) a conservative variant of i) iii) a fragment of i) or ii); wherein the conservative variant and/or fragment retains biological activity and the peptide is 15 or less amino acids as well as recombinant cells, and uses thereof.

Abstract: A method for forming a small outline "J" lead for a semiconductor device having a main body and a lead comprises three bend steps. The lead comprises a surface attached to the body, a distal end away from the body, and a proximal area interposed between the attached surface and the distal end. The method consists of the lead bend steps of rounding the distal end of the lead in a single bend step to form an are in the distal end having a radius of between 0.030" and 0.040", the arc terminating toward the proximal area of the leads in a substantially straight lead portion. Next, the proximal area of the lead is bent close to the attached surface such that the proximal area of the lead forms an angle of between about 60.degree. and 90.degree. with the attached surface of the lead. Finally, the arc in the distal end is increased to a radius of between about 0.035" and 0.045".

Abstract: A component support assembly releasably retains, electrically insulates and improves thermal transfer of a plurality of vertically stacked electrical components associated with the operation of a printed circuit card. Each of a plurality of integrally-molded component support structures made of a electrically insulating material has a base member, a receiving member for releasably retaining electrical components thereto and pins for anchoring the base member to a printed circuit card. The base member has apertures so that the electrical leads of the electrical components can pass through the base member and connect to the conductors of the printed circuit card. The base member is shaped so that major planar surfaces of the electrical components are retained at an acute angle relative to vertical, thereby improving thermal transfer from the electrical components to the ambient air when a plurality of like component support structures are mounted on the printed circuit card.