Patents by Inventor Michael P. Humbert

Michael P. Humbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating circuit assembly and method of manufacture
    Patent number: 10440829
    Abstract: A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: October 8, 2019
    Assignee: United Technologies Corporation
    Inventors: Sameh Dardona, Michael P. Humbert, John P. Wesson, Wayde R. Schmidt, Daniel V. Viens, Jin Hu
  • HEATING CIRCUIT ASSEMBLY AND METHOD OF MANUFACTURE
    Publication number: 20160007474
    Abstract: A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.
    Type: Application
    Filed: July 2, 2015
    Publication date: January 7, 2016
    Inventors: Sameh Dardona, Michael P. Humbert, John P. Wesson, Wayde R. Schmidt, Daniel V. Viens, Jin Hu