Abstract: The invention of the present document comprises apparatus for receiving and automatically feeding dual-in-line package (DIP) transportation and storage tubes (24) to the singulator (76) of an integrated circuit device handler (20) so that devices (22) in the tubes (24) can be introduced at the singulator (76). The tubes (24) are randomly placed in a hopper (66), and conveyed through an aperture (170) formed in a side wall (172) of the hopper (66). An elevator (74) is provided to raise the tubes (24) to a height at which open ends thereof are disposed above the height of the singulator (76). With a tube (24) so raised, a tube inserter (96) pushes the tube (24) into the tube holder (98) of a manipulator (100). The tube holder (98) is, in turn, pivoted to tilt the tube (24) so that devices (22) within the tube (24) are deposited for introduction into the singulator (76 ).

Abstract: The present invention is a device for bringing integrated circuit devices (22), to be tested at a test site, to a temperature to which the devices (22) will be subjected during operating conditions of equipments in which they will ultimately be installed. The device includes a rack (30) comprising a plurality of rails (32) overlying corresponding tracks (24) down which the integrated circuits (22) move through a magazine (20). The rails (32) are adjustable toward and away from their corresponding tracks (24), and both are heated in order to impart thermal energy to integrated circuit devices (22) passing down the tracks (24). Each track (24) has, proximate a lower end thereof, a singulation assembly (56) which not only isolates a single device (22) to be passed to a test site, but also functions to press the lowermost device (22) in a string passing down the respective track (24) into close engagement with the track (24) in order to effect maximum heat transfer.