Abstract: Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract: Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract: Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.

Abstract: Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.

Abstract: Disclosed are compositions suitable for the electrolytic stripping of tin and tin-alloys from a substrate as well as methods of stripping such tin and tin-alloys. The compositions are particularly suitable for the electrolytic stripping of lead-free tin alloys, and more particularly for stripping tin and tin-alloys from stainless steel substrates.

Abstract: Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Abstract: Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.

Abstract: Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.

Abstract: The invention relates to an electrolyte for depositing tin-rich tin-silver alloys upon a substrate. This electrolyte includes a basis solution containing a solution soluble tin and silver compounds; a tin chelating agent of a polyhydroxy compound in an amount sufficient to complex tin ions provided by the tin compound; and a silver chelating agent of a heterocyclic compound in an amount sufficient to complex silver ions provided by the silver compound. Preferably, the tin and silver compounds are present in relative amounts to enable deposits containing about 85 to 99% by weight tin and about 0.5 to 15% by weight silver to be obtained.

Abstract: A process for depositing tin upon a steel strip by high speed electroplating to produce tinplate, which includes a basis solution of an alkyl sulfonic acid, a solution soluble tin compound and a surfactant, preferably of an alkylene oxide condensation compound of 1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or 2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of six carbon atoms or less. After electroplating, the tinplate is rinsed and the rinse water only needs to be treated for removal of tin ions prior to discharge by normal procedures.

Abstract: An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less, carbon atoms and at least one hydroxy group, or (2) an organic compound having no more than a total of twenty carbon atoms in one or two independent or joined rings optionally substituted with an alkyl moeity of less than six carbon atoms.

Abstract: An electrolyte, system and process for depositing tin, lead or tin/lead alloys upon a substrate by high speed electroplating, which includes a basis solution of an alkyl or alkylol sulfonic acid; and at least one of a solution soluble tin compound or a solution soluble lead compound; and an alkylene oxide condensation compound of (1) an aliphatic hydrocarbon having seven, preferably six or less carbon atoms and at least one hydroxy group, or (2) an aromatic organic compound having at least one hydroxyl group and no more than two independent or joined rings optionally substituted with an alkyl moiety of a total of twenty carbon atoms in one or six carbon atoms or less.

Abstract: Alkaline aqueous electrolytes for the electrodeposition of palladium comprising a soluble palladium compound, one or more complexing agents of an organic compound containing a heterocyclic ring having one or more nitrogen atoms in the ring position, at least one carboxyl group substituted on a ring carbon, and at least one hydroxyl or carbonyl oxygen attached to a ring carbon. The palladium compound and complexing agents are soluble in the electrolyte. Optionally, one or more soluble alloying metal compounds can be added to the electrolyte when palladium alloys are to be electrodeposited therefrom. Also, methods for formulating these electrolytes and for electrodepositing palladium or palladium alloys therefrom.

Abstract: Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.

Abstract: An electroplating bath composition is disclosed which permits high speed palladium deposition. The bath comprises carbonate or phosphate anion in a critical amount and is otherwise additive free. A pH of 7-9 is used.

Abstract: The invention relates to a method for high speed palladium electroplating by immersing the object to be plated in an ammoniacal solution of a palladium tetra-amino complex ion, palladium metal in a concentration of at least 10 g/l, and at least one carbonate or phosphate anion in a concentration of more than about 7.5 g/l and less than about 150 g/l. The solution has a pH of between about 7 and 9 and is free of quaternized pyridinium brightening agents. Palladium is plated into a substrate with high speed plating equipment which provides sufficient agitation, and current densities of 100 ASF and above to produce lustrous crack free deposits.