Patents by Inventor Michael Pailey

Michael Pailey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260175486
    Abstract: A method for forming an overmolded component, includes arranging a first mold part and a second part with at least part of a first mold cavity defined by the first mold part and the second mold part, providing material to form a substrate into the first mold cavity, providing an overmold cavity that is defined at least in part by the substrate, one or both of the first mold part and second mold part, and a seal that engages the substrate and also engages one or both of the first mold part and the second mold part, and providing material for an overmolded layer in the overmold cavity. The overmold layer may be formed from a material having low viscosity and the seal inhibits or prevents overflow of the overmold material to reduce or eliminate formation of flash at parting or junction lines in the molding process.
    Type: Application
    Filed: December 16, 2025
    Publication date: June 25, 2026
    Inventors: Heiner Salzmann, Riad Chaaya, Stanislav Tichy, Peter V. MacLean, Mark Hess, Parvinder S. Walia, Marek Blascik, Michael Pailey, Miguel Benitez