Abstract: A power module includes a first board comprising a first surface and a second surface opposite to each other and perpendicular to a bottom surface of the power module for mounting the power module to a circuit board, the bottom surface providing electrical connections to the circuit board, a first charge pump assembly mounted on the first surface, the first charge pump assembly comprising a first power conversion circuit configured to convert an input voltage to an output voltage, and a first vertical heatsink structure arranged adjacent to the first charge pump assembly, the first charge pump assembly being placed between the first vertical heatsink structure and the first board.

Abstract: A packaged radio frequency (RF) module is disclosed. The module can include a substrate, a first die electrically and mechanically attached to the substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material, and a lid attached to the substrate. The first die comprises a silicon-based die, such as an RF switch die, and the second die comprises a compound semiconductor die, such as an RF amplifier. The encapsulating material can protect electrical connections between the first die and the substrate. The substrate and the lid at least partially define an air cavity within which the first and the second die are mounted. An active surface of the second die is exposed to the air cavity.

Abstract: A packaged radio frequency (RF) module is disclosed. The module can include a substrate, a first die electrically and mechanically attached to the substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material, and a lid attached to the substrate. The first die comprises a silicon-based die, such as an RF switch die, and the second die comprises a compound semiconductor die, such as an RF amplifier. The encapsulating material can protect electrical connections between the first die and the substrate. The substrate and the lid at least partially define an air cavity within which the first and the second die are mounted. An active surface of the second die is exposed to the air cavity.