Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, with the center of curvature on the side of the second primary surface so as to induce a bending stress ?B at the first primary surface, ?I+?B<0. Still further, the glass element has a puncture resistance of ?1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, with the center of curvature on the side of the second primary surface so as to induce a bending stress ?B at the first primary surface, ?I+?B<0. Still further, the glass element has a puncture resistance of ?1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A strengthened glass article has a chemically-etched edge and a compressive stress layer formed in a surface region thereof. The compressive stress layer has a compressive stress and a depth of layer. A product of the compressive stress and depth of layer is greater than 21,000 ?m-MPa. A method of making the strengthened glass article includes creating the compressive stress layer in a glass sheet, separating the glass article from the glass sheet, and chemically etching at least one edge of the glass article.

Abstract: A strengthened glass sheet or article having an edge profile that provides improved edge strength, particularly when the strengthened glass sheet is subjected to a four point bend test, and a method of making a glass sheet having such an edge. The edge is formed by cutting or other separation methods and then ground to a predetermined profile such as a pencil or bullet profile, a bull nose profile, or the like. In some embodiments, the edge is polished and/or etched following grinding to reduce flaw size.