Patents by Inventor Michael Pengelly

Michael Pengelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7855893
    Abstract: In general, an improved handle assembly in accordance with the present invention is configured to be removably attached to a printed circuit board (PCB), such as a vehicle detector PCB. The handle assembly includes a faceplate, a handle extending outward from the front surface of the faceplate, and an enclosure extending from the back surface of the faceplate, wherein the enclosure has an open side configured to interface with the printed circuit board, and an external surface configured to accept printed indicia (e.g., operating instructions relating to functionality of the printed circuit board). In a preferred embodiment, the handle assembly is an integral, plastic (e.g., polycarbonate) structure, and is configured to cover one or more temperature-sensitive components attached to the board.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: December 21, 2010
    Assignee: Eberle Design, Inc.
    Inventor: Michael Pengelly
  • Publication number: 20070223203
    Abstract: In general, an improved handle assembly in accordance with the present invention is configured to be removably attached to a printed circuit board (PCB), such as a vehicle detector PCB. The handle assembly includes a faceplate, a handle extending outward from the front surface of the faceplate, and an enclosure extending from the back surface of the faceplate, wherein the enclosure has an open side configured to interface with the printed circuit board, and an external surface configured to accept printed indicia (e.g., operating instructions relating to functionality of the printed circuit board). In a preferred embodiment, the handle assembly is an integral, plastic (e.g., polycarbonate) structure, and is configured to cover one or more temperature-sensitive components attached to the board.
    Type: Application
    Filed: March 21, 2006
    Publication date: September 27, 2007
    Inventor: Michael Pengelly