Abstract: An apparatus and method to align and assemble a photonic package with sub-micron placement accuracy. The apparatus, or feature, maintains mechanical contact between a first and a second photonic component while the two photonics are aligned and affixed together. The package may comprise the first photonic component having a contact surface and the second photonic component having a partially spherical surface. The contact surface is shaped and fitted to rotatably couple with the partially spherical surface while permitting the partially spherical surface to move in at least three rotational degrees of freedom. The two photonic components are then aligned as desired and affixed together. Certain variations permit motion of the partially spherical surface in three rotational degrees of freedom and one linear degree of freedom. At least one version of the invention includes aligning and assembling an optical fiber with an optical MEMS-based device.