Patents by Inventor Michael Petti

Michael Petti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an interlayer via and a laminate precursor useful for same
    Patent number: 6368697
    Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: April 9, 2002
    Assignee: Honeywell International Inc.
    Inventors: Michael Petti, Gordon C. Smith
  • Method of manufacturing an interlayer via and a laminate precursor useful for same
    Patent number: 6120693
    Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: September 19, 2000
    Assignee: AlliedSignal Inc.
    Inventors: Michael Petti, Gordon C. Smith