Patents by Inventor Michael Philip Brownell

Michael Philip Brownell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package ejector
    Patent number: 6490167
    Abstract: In an embodiment of the present invention, an apparatus to eject a semiconductor package from a semiconductor package socket includes a package ejector coupled to a semiconductor package socket. The package ejector can include an ejector cam and be coupled to an upper surface of the semiconductor package socket.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: December 3, 2002
    Assignee: Intel Corporation
    Inventors: Michael Philip Brownell, James G. Maveety, Richard Michael Ramirez, William Arthur Samaras
  • Heatpipesink having integrated heat pipe and heat sink
    Patent number: 6410982
    Abstract: Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of condenser regions can be located within one of the plurality of hollow fins. The inner cavity also can include an evaporator region adjacent said bottom wall.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: June 25, 2002
    Assignee: Intel Corporation
    Inventors: Michael Philip Brownell, James G. Maveety