Abstract: The present invention provides a system and a method for metal deposition in semiconductor processing, the system comprising a plating tool with one or more plating tanks, each containing one of a respective electrolyte solution, one or more replenishment sections each fluidly connected to a respective one of the one or more plating tanks, one or more draining sections each fluidly connected to a respective one of the one or more plating tanks, and a control system adapted to operate the one or more replenishing sections and/or the one or more draining sections so as to maintain a condition of the electrolyte solutions.

Abstract: By providing an enhanced drive system for electrochemical etch process tools, the operational range, as well as the reliability, may be enhanced. For this purpose, a high torque electric motor may be used in combination with an appropriate power transmission, which may be attached to a corresponding tool frame at a height level that is above a corresponding height level at which respective chemicals are provided to the substrate under process. Hence, the probability for contamination by chemicals may be significantly reduced, thereby also reducing maintenance efforts resulting in reduced production costs.

Abstract: By providing an enhanced drive system for electrochemical etch process tools, the operational range, as well as the reliability, may be enhanced. For this purpose, a high torque electric motor may be used in combination with an appropriate power transmission, which may be attached to a corresponding tool frame at a height level that is above a corresponding height level at which respective chemicals are provided to the substrate under process. Hence, the probability for contamination by chemicals may be significantly reduced, thereby also reducing maintenance efforts resulting in reduced production costs.